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Resin composition for forming heat-cured film

A technology of resin composition and thermal curing, which is applied in the field of resin composition for thermal curing film formation and cured film, can solve the problems of flatness and transparency reduction, and achieve simplification and low cost, high flatness, and high transparency sexual effect

Active Publication Date: 2010-03-24
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if it is regarded as a flattening film of a color filter, there are problems such as a large decrease in flatness and transparency.

Method used

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  • Resin composition for forming heat-cured film
  • Resin composition for forming heat-cured film
  • Resin composition for forming heat-cured film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0134] Hereinafter, examples are given and the present invention will be described in more detail, but the present invention is not limited to these examples.

[0135] [Abbreviations used in Examples]

[0136]The meanings of the abbreviated symbols used in the examples below are as follows.

[0137] PGMEA: Propylene Glycol Monomethyl Ether Acetate

[0138] NMP: N-Methylpyrrolidone

[0139] BMI1: N,N'-(3,3-diethyl-5,5-dimethyl)-4,4-diphenylmethanebismaleimide

[0140] BMI2: 2,2-bis(4-(4-maleimidophenoxy)phenyl)propane

[0141] BMI3: N,N'-4,4-diphenylmethane bismaleimide

[0142] CBDA: 1,2,3,4-cyclobutane tetracarboxylic dianhydride

[0143] TDA: 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic dianhydride

[0144] DDS: Bis(4-aminophenyl)sulfone

[0145] DA-1M: 4,4'-bis(4-aminophenoxy)diphenylsulfone

[0146] HBPDA: 3,3',4,4'-Dicyclohexyltetracarboxylic dianhydride

[0147] [Determination of number average molecular weight and weight average molecular weight]

...

Synthetic example 1

[0150] A polyimide precursor solution (solid content concentration: 30.0 mass %) was obtained by making CBDA 14.7g, TDA 22.5g, and DDS 26.1 react in NMP 147.7g at 23 degreeC for 24 hours (P1). Mn of the obtained polyimide precursor was 2,000, and Mw was 3,500.

Synthetic example 2

[0152] A polyimide precursor solution (solid content concentration: 30.0 mass %) was obtained by making CBDA 19.6g and DDS 17.4 react in NMP 86.3g at 23 degreeC for 24 hours (P2). Mn of the obtained polyimide precursor was 3,200, and Mw was 5,500.

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Abstract

To provide a resin composition for heat-cured-film formation which can form a cured film having the property of aligning liquid crystals and realizing high transparency and high planarization. ¢MEANSFOR SOLVING PROBLEMS! The resin composition for heat-cured-film formation comprises ingredients (A) and (B). Ingredient (A): A polyimide precursor having structural units represented by the followingformulae (1) and (2). Ingredient (B): A bismaleimide compound. (In the formulae, A1 is an organic group including an alicyclic structure; A2 is an organic group comprising a structure having an organic group including a structure formed by the fusion of an aliphatic ring with a benzene ring; at least one of B1 and B2 is an organic group including the structure -SO2-; and R1, R2, R3, and R4 each independently represents hydrogen or a C1-7 organic group.

Description

technical field [0001] The present invention relates to a resin composition for forming a thermosetting film and a cured film obtained from the composition. More specifically, it relates to a resin composition for forming a thermosetting film containing a polyimide precursor having high flatness during step coating and having liquid crystal orientation, a cured film thereof, and applications of the cured film. This composition for thermosetting film formation is used especially suitably as a color filter coating agent which has the function of aligning a liquid crystal in a liquid crystal display. Background technique [0002] In general, in optical devices such as liquid crystal display elements, organic EL (electroluminescent) elements, and solid-state imaging elements, a protective film is provided to prevent the element surface from being exposed to solvents and heat during the manufacturing process. Such a protective film requires not only high adhesion to the substrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08G02F1/1337
CPCC08J5/18C08J2379/08G02F1/133723C08G73/10
Inventor 畑中真小林淳平D·A·樱叶汀
Owner NISSAN CHEM IND LTD
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