Method of producing surface acoustic wave devices by exposing X-rays in a direct writing way

Abstract

The invention discloses a method of producing surface acoustic wave devices by exposing X-rays in a direct writing way. Electron beam resist concave solid figures of an interdigital transducer are obtained by photoetching electron beams on a piezoelectric substrate, and various surface acoustic wave devices are produced with the stripping technology. The method of producing surface acoustic wave devices by exposing X-rays in a direct writing way comprises the following concrete steps: spreading the electron beam resist on the piezoelectric substrate; prebaking the electron beam resist; growingmetal material which has weak back scattering effect on the electron beam exposure; exposing the electron beams in a direct writing way; removing the metal layer; developing the electron beam resist;fixing the electron beam resist; growing interdigital electrode metal and stripping a beam resist masking film. An interdigital electrode produced with the method has steep and straight edges and good width control, and the method can be used for producing the surface acoustic wave devices which have the characteristic linewidth of less than 500nm. The method needs less process steps and is simple, stable and reliable.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing in microelectronics and surface acoustic wave devices, and particularly relates to a method for manufacturing surface acoustic wave devices using electron beam direct writing exposure, that is, a method for manufacturing electrodes with nanoscale interdigital transducers . Background technique [0002] According to the transmission properties of surface acoustic waves, for common piezoelectric media, when the working center frequency reaches 1 GHz, the interdigital electrodes will be smaller than 1 micron. With the operating frequency of mobile communication systems rising above 2GHz and the development of micro-sensing technology, surface acoustic wave devices are developing in the direction of high frequency and high performance, which poses challenges to the manufacture of surface acoustic wave devices and requires The width and spacing of the finger electrodes must be smaller an...

AI Technical Summary

Problems solved by technology

[0007] In view of this, the main purpose of the present invention is to provide a method for fabricating surface acoustic wave devices using electron beam direct writing exposure, to solve the problem of electron beam direct writing exposure on insulating piezoelectric substrates, and to protect the surface of the substrate , to control the electrode shape

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