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Electronic component packing body

一种电子部件、包装体的技术，应用在包装、包装纸、电气元件等方向，能够解决无法进行热密封、阻碍粘接树脂粘着特性、剥离等问题

Inactive Publication Date: 2010-02-17
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a low-molecular-weight surfactant is used on the surface (heat-sealing surface) of the cover tape that is in contact with the components, bleed-out is caused to hinder the adhesive properties of the adhesive resin, and thus, failure to perform Heat-sealing, or defects such as peeling over time

Method used

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  • Electronic component packing body
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Examples

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Embodiment Construction

[0096] Hereinafter, the present invention will be described in more detail by giving examples, but the present invention is not limited to these examples. In addition, in an Example, unless otherwise indicated, "part" and "%" represent "part by mass" and "% by mass".

[0097] Examples and Comparative Examples

[0098] A base film (substrate layer) with a film thickness of 25 μm was used as the outer layer, and an intermediate layer with a thickness of 15 μm was formed on the base film by extrusion lamination to obtain a film with a total thickness of 40 μm. After activating the surface of the film obtained above by corona treatment, it was coated according to the composition shown in Table 1 and Table 2 (thickness after drying: 1 μm) to form a heat-sealing layer and obtain a film (cover tape) .

[0099] Mount the electronic components on a 8mm wide polystyrene carrier tape (raw material: polystyrene doped with carbon), cut the cover tape obtained above to a width of 5.5mm, a...

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PUM

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Abstract

Provided is an electronic component packing body which can prevent adhesion of an electronic component to a cover tape due to static electricity (pickup failure and the like) and component breakage due to ESD, by suppressing static electricity generated by friction between a stored electronic component (especially a small and light weight electronic component) and the cover tape. The electronic component packing body is composed of an electronic component packing carrier tape wherein the electronic component is stored, and an electronic component packing cover tape. A layer of the cover tape to be brought into contact with the carrier tape includes an adhesive resin (A), and an electrostatically chargeable resin (B) which is electrostatically charged reversely to the electrostatic chargingpolarity, which is of the adhesive resin (A) and generated by friction between the adhesive resin (A) and the electronic component.

Description

technical field [0001] The present invention relates to an electronic component package capable of protecting electronic components from contamination during storage, transportation, and installation of electronic components, arranging electronic components so as to be mounted on an electronic circuit board, and having a removal function. Background technique [0002] Surface-mounted electronic components such as transistors, diodes, capacitors, and piezoelectric element resistors represented by ICs are usually packaged and provided in a package composed of a tray with a concave portion according to the electronic The shape of the component is embossed to form a recess capable of accommodating the electronic component, or the package is composed of a carrier tape continuously formed with the recess and a cover tape that can be heat-sealed with the carrier tape. The carrier tape on which the electronic components are packaged is usually wound on a reel made of paper or plasti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/38B32B27/08B65D65/40B65D73/02B65D85/86
CPCB65D2213/02B65D75/327H05K9/0067H05K13/0084B65D85/38B65D2585/86B32B27/08B32B7/12B32B27/20B32B27/302B32B27/308B32B27/32B32B27/34B32B27/36B32B27/38B32B27/42B32B2262/106B32B2264/108B32B2270/00B32B2307/202B32B2307/306B32B2307/31B32B2307/412B32B2307/518B32B2439/00Y10T428/2848Y10T428/1352B65D85/00B65D73/02B65D65/40
Inventor 平松正幸
Owner SUMITOMO BAKELITE CO LTD
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