LED device and packaging method thereof

A technology for LED devices and packaging methods, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that high-power products cannot pass the reflow soldering process, high-power products are seriously damaged, time-consuming and labor-intensive, etc., to avoid light loss, improve Product yield and wide applicability

Inactive Publication Date: 2010-02-17
上海科学院 +1
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, since the melting point of polycarbonate is at most about 150°C, such high-power products cannot pass the reflow soldering process. In practical applications, manual soldering must be used, which is time-consuming and labor-intensive, and the damage to high-power products is also serious.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED device and packaging method thereof
  • LED device and packaging method thereof
  • LED device and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] figure 1 The flow of a preferred embodiment of the packaging method of the LED device of the present invention is shown. See figure 1 , the following is a detailed description of each step in the method.

[0021] Step S10: Fixing / Soldering Step: Fixing the chip and soldering the chip to form a light-emitting unit.

[0022] Step S11: Molding step: see also figure 2 , Fix the bracket 2 with a clamp, place the mold bar 1 on the bracket 2, make the bracket 2 integrally embedded in the mold bar 1, and then fix the mold bar 1 with a clamp to make it completely closed.

[0023] Step S12: Glue filling step: see also image 3 , use a syringe to inject the silicone from the injection port A until the silicone overflows from the injection port B, control the pressure and time, and press out all the air in the mold bar 1. Different perfusion angles can ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an LED device-packaging method and an LED device. The LED device-packaging method improves the rate of good products. The invention adopts a technical scheme that the packagingmethod comprises: fixing a chip and welding the chip to form a unit capable of emitting light; fixing a bracket and integrally embedding the bracket in a die strip; filling the die strip with silicagel so as to extrude all air in the die strip; baking the bracket and the die strip fixed together till a silica-gel lens is formed; taking down the die strip from the bracket; and performing leg cutting on the die strip to divide the die strip into single devices. The packaging method is applied to the packaging of the LED device.

Description

technical field [0001] The present invention relates to an LED device and a packaging method thereof, in particular to an LED device integrally formed with optical lens silica gel and a packaging method of the LED device. Background technique [0002] At present, the optical lens part in the packaging structure of high-power products is generally made of polycarbonate. In the process of application, in order to ensure the extraction of light, the polycarbonate lens is directly fixed on the device with a combination agent. The lens is filled with silica gel. After the light is taken out from the chip, it passes through the silica gel, then passes through the polycarbonate lens, and finally To air, light loss is severe. At the same time, since the melting point of polycarbonate is at most about 150°C, this type of high-power products cannot pass the reflow soldering process. In practical applications, manual soldering must be used, which is time-consuming and labor-intensive,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L33/00
Inventor 向德祥
Owner 上海科学院
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap