LED device and packaging method thereof
A technology for LED devices and packaging methods, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems that high-power products cannot pass the reflow soldering process, high-power products are seriously damaged, time-consuming and labor-intensive, etc., to avoid light loss, improve Product yield and wide applicability
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[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0020] figure 1 The flow of a preferred embodiment of the packaging method of the LED device of the present invention is shown. See figure 1 , the following is a detailed description of each step in the method.
[0021] Step S10: Fixing / Soldering Step: Fixing the chip and soldering the chip to form a light-emitting unit.
[0022] Step S11: Molding step: see also figure 2 , Fix the bracket 2 with a clamp, place the mold bar 1 on the bracket 2, make the bracket 2 integrally embedded in the mold bar 1, and then fix the mold bar 1 with a clamp to make it completely closed.
[0023] Step S12: Glue filling step: see also image 3 , use a syringe to inject the silicone from the injection port A until the silicone overflows from the injection port B, control the pressure and time, and press out all the air in the mold bar 1. Different perfusion angles can ...
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