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High vacuum exhaustion laser sealing device and process of micro-infrared detector

A technology of infrared detectors and sealing devices, applied in laser welding equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of sealing and clamping, and achieve the effects of convenient use, reliable implementation space, and simple structure

Inactive Publication Date: 2010-01-06
SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a new type of device and process for subsequent packaging of micro-infrared detectors to solve the sealing and clamping problem of high-vacuum exhaust of micro-infrared detectors

Method used

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  • High vacuum exhaustion laser sealing device and process of micro-infrared detector

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Embodiment Construction

[0034] The specific embodiment of the present invention is described in further detail below in conjunction with accompanying drawing:

[0035] The high-vacuum baking exhaust device of the present invention includes: an outer casing 1, a sample stage 2, a support column 201, a heating ring 202, a vacuum maintaining system, and the like.

[0036] Fix the sample 3 on the sample stage 2 in the vacuum chamber. The heating ring 202 close to the bottom of the sample stage 2 is connected to the circular stainless steel fixing groove 203 through four bolts. In order to slow down the heat transfer, the three support columns 201 fixed on the bottom of the outer casing 1 are made of tetrafluoroethylene, and used to support the sample stage 2. After adjusting to a suitable height, the sample stage 2 and the support columns 201 are fixed with nuts.

[0037] Then, close the tempered glass airtight door, use the TURBOVAC-50K high vacuum molecular pump exhaust unit to connect the exhaust por...

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Abstract

The invention discloses a high vacuum exhaustion laser sealing device and a process of a micro-infrared detector. The device mainly comprises an outer shell, a sample platform, a heating ring and a temperature and vacuum keeping system. The process comprises the following steps: fixing a sample on the sample platform; connecting the heating ring below the sample platform with a fixed groove through a bolt; connecting the sample platform through three support posts fixed at the bottom of the outer shell; closing a reinforced glass sealing door; pumping high vacuum in a cavity by a vacuum exhaustion dolly through an exhaust port, and opening the power supply of a heater in exhaustion; baking devices to exhausting air completely; sealing the sample by a laser technology through a laser transmission port after finishing preparing vacuum. With the advantages of simple structure and convenient use, the invention establishes a process foundation for a detector encapsulation technology tending to integration and micromation, and provides a reliable execution space for a non-refrigeration type or thermoelectric refrigeration type micro-infrared detector for exhaustion by high vacuum baking and laser sealing after removing an exhaust pipe.

Description

technical field [0001] The invention relates to laser processing technology, in particular to a micro-infrared detector high-vacuum exhaust laser sealing device and process. Background technique [0002] Since most infrared detectors work in a cryogenic state, heat insulation and vacuum maintenance are the most critical and basic in design. [0003] The vacuum life of an infrared detector is mainly determined by the comprehensive factors of material outgassing, leak rate, exhaust process and getter. Its materials mainly include stainless steel, Kovar, titanium alloy, oxygen-free copper and some non-metallic materials, such as 95 ceramics, low-temperature glue, etc. [0004] The invention is based on a high-vacuum exhaust sealing process in the packaging of non-cooling or thermoelectric cooling infrared detector components. The current process method is to braze an oxygen-free copper exhaust pipe (diameter ≈ φ6mm) on the device wall, and perform high-vacuum exhaust through ...

Claims

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Application Information

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IPC IPC(8): B23K26/12B23K26/24B23K26/42
Inventor 俞君朱三根王小坤曾智江郝振贻
Owner SHANGHAI INST OF TECHNICAL PHYSICS - CHINESE ACAD OF SCI
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