Conducting wire stack type suture joint in semiconductor device

Abstract

The invention discloses low-profile semiconductor package comprising at least a first stacking semiconductor circuit small piece and a second stacking semiconductor circuit small piece which are arranged on a substrate, wherein the first semiconductor circuit small piece can be electrically coupled to the substrate by a plurality of sutures in a forward pillow joint technology, the second semiconductor circuit small piece can be electrically coupled to the first semiconductor circuit small piece by a second group of sutures which are jointed between circuit small piece joint pads of the first semiconductor circuit small piece and the second semiconductor circuit small piece, each suture of the second group of sutures comprises a suture ball, the front end of the suture ball is connected to the joint pad of the second semiconductor circuit small piece, and the tail end of each suture of the second group of sutures can be directly connected to the front end of the suture of a first group of sutures in a wedge shape.

Description

technical field [0001] Embodiments of the present invention relate to a low-profile semiconductor device and a method of manufacturing the same. Background technique [0002] The strong growth in demand for portable consumer electronics is driving the need for high capacity storage devices. Non-volatile semiconductor memory devices, such as flash memory memory cards, are becoming widely used to meet the ever-increasing demand for digital information storage and exchange. Its portability, versatility and rugged design, as well as its high reliability and large capacity make such memory devices ideal for use in a variety of electronic devices including, for example, digital cameras, digital music players, video games Consoles, PDAs and cellular phones. [0003] Although a variety of packaging configurations are known, flash memory memory cards are typically manufactured as system-in-a-package (SiP) or multi-chip modules (MCM), where functional systems are assembled into a si...

AI Technical Summary

Problems solved by technology

First, having to add extra stitch balls in the reverse wire bonding process increases the processing steps and time of the manufacturing process, especially given the large number of bonds required in any given semiconductor package

Additionally, the ball-wire-ball configuration has a relatively bulky construction which has a high suture failure rate

In one example of a four memory die microSD package, a yield loss of about 2000PPM (parts per million) has been found

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