Method for transplanting and maintaining finished printed circuit board product with multiple types

Abstract

The invention relates to a method for transplanting and maintaining a finished printed circuit board product with multiple types mainly for a multi-type finished printed circuit board product with a bad printed circuit board slice which can be recovered into a good product through a serial processing and maintenance method. The method comprises the following steps: removing the bad printed circuit board slice so as to form a through space joined with a side board and milling combination parts containing a first combination part and a second combination part on the side board; cutting a good printed circuit board slice which can be accommodated in the through space of the finished printed circuit board product and reserving a joint pin which is closely connected with the first combination part and corresponds to the second combination part at intervals on the periphery; sticking an adhesive tape at the bottom of the joint part of the finished printed circuit product; transplanting the cut good printed circuit board slice in the through space of the finished printed circuit board product and closely connecting the joint pin with the first combination part of the side board; filling glue in an adhesive groove formed between the joint pin and the second combination part of the side board of the transplanted good printed circuit board slice and solidifying the filled glue. A good product can be recovered by the method so as to achieve the purposes of improving the utilization rate, reducing material waste, reducing the production cost and meeting the requirement of environmental protection.

Description

technical field [0001] The invention relates to a repairing method, in particular to a method for transplanting and repairing finished printed circuit boards with defective printed circuit boards and multi-piece layout. Background technique [0002] According to the current printed circuit board (PCB) industry, most of them are produced by high-density and multi-layer lamination manufacturing process, in order to achieve dense circuit and small size, and to make electronic information products have functional diversity. [0003] In addition, in order to achieve low price and high quality printed circuit boards, they are currently produced quantitatively by multi-chip typesetting. However, due to the large number of manufacturing processes and high precision requirements, it is inevitable that the production process will be affected by environmental changes or human negligence. And other factors, resulting in some bad situations in the finished printed circuit board. [0004...

AI Technical Summary

Problems solved by technology

[0017] The purpose of the present invention is to overcome the defects of the existing transplantation and maintenance method of printed circuit board finished products with multi-piece typesetting, and provide a new transplantation and maintenance method for printed circuit board finished products with multi-piece typesetting. The technical problem to be solved is to make the finished multi-piece typesetting printed circuit board with bad printed circuit board pieces, regardless of the thickness or whether there are positioning holes, through a series of processing and repair methods, it will be easy, convenient, fast and reliable. As a good product, the utilization rate can be greatly increased, thereby achieving the purpose and effect of reducing material waste, reducing production costs and meeting environmental protection requirements for energy saving and carbon reduction

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