Heat radiation device for loop heat pipe with enhanced evaporation section used in LED lamp

Abstract

The invention discloses a heat radiation device for a loop heat pipe with an enhanced evaporation section used in an LED lamp. The heat radiation device comprises: a heat pipe, a radiating fin and a working liquid. The heat pipe is a loop pipe with a sealed cavity, comprising: an enhanced evaporation section, a reflux section, a steam section, a compensation chamber and a condensing section; the enhanced evaporation section is arranged at the back of a heat source of the LED lamp; the loop pipe is vacuumed properly, internally provided with a wick structure and filled with a proper amount of working liquid; and the radiating fin is arranged on the condensing section. The heat radiation device has the advantages of reasonable and compact structure, easy production, high heat conduction efficiency and high heat radiation speed. The enhanced evaporation section is contacted with the heat source surface directly and sufficiently, therefore, the heat radiation device can effectively reduce the temperature of the LED modules, solve the heat radiation problem of large-power LEDs, improve the light emitting efficiency of LEDs, reduce the light degradation speed of LEDs and prolong the service life of LEDs. Simultaneously, the heat radiation device can reduce the volume and the weight of LED lamps and improve the adaptability and the use range of the LED lamps.

Description

technical field [0001] The invention relates to a heat transfer device, in particular to a loop heat pipe cooling device using an enhanced evaporating section, which can be applied to the field of LED high-power lighting or the application field of electronic components requiring heat dissipation. Background technique [0002] High-power LEDs are being used more and more in lighting. At present, the heat dissipation problem of high-power LEDs is still a problem that hinders the rapid popularization of high-power LED lighting applications. Most of the electrical energy of high-power LEDs is converted into conduction heat. In addition, placing several or a large number of LEDs in a module to achieve the required brightness will cause difficulty in heat dissipation, and the temperature of the LED module will rise, resulting in LEDs. The lifespan is reduced, and the light decay of the LED is accelerated, and the efficiency and reliability of the LED driver and other components a...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects of the existing heat pipe cooling methods, and provide a loop heat pipe cooling device with an enhanced evaporation section for LED lamps

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