Aluminum alloy and LED lamp substrate applying same

Abstract

The invention discloses aluminum alloy and an LED lamp substrate applying the aluminum alloy. The aluminum alloy comprises the following compositions in percentage by weight: more than or equal to 0.5 percent and less than or equal to 12 percent of Si, more than or equal to 0.1 percent and less than or equal to 1.5 percent of Mn, less than or equal to 1.2 percent of Fe, less than or equal to 4.5 percent of Cu, less than or equal to 0.5 percent of Mg, more than or equal to 0.005 percent and less than or equal to 0.85 percent of RE, less than or equal to 0.5 percent of inevitable impurities, and the balance of Al, wherein the RE is selected from at least one of La, Ce, Nd and Yb. The LED lamp substrate is provided with a copper plate and an aluminum alloy plate, and the copper plate and the aluminum alloy plate are jointed into a whole through high pressure forming. The aluminum alloy has excellent thermal conductivity and high temperature antioxidation performance, and is suitable for manufacturing the LED lamp substrate. The LED lamp composite substrate completely solves the problems of deformation and oxidation caused by uneven thermal expansion coefficients of two materials for the substrate and a lamp shell in the prior art, and contributes to manufacture of high power LED lamps in low cost.

Description

technical field [0001] The invention relates to an aluminum alloy material, and also relates to an LED lamp substrate applied with the aluminum alloy material. Background technique [0002] Light emitting diodes (LEDs) have been widely used in various fields due to their environmental protection, energy saving, long service life and sufficient brightness. However, single LED lamps are usually only used as indicator lights because their brightness cannot meet the requirements of standard lighting fixtures. For this reason, people want to place multiple LEDs on the printed circuit board or install high-power LEDs to overcome the above defects, but after LEDs are dense or high-power LEDs are used, a lot of heat will be generated during use, and when the heat cannot When it is dissipated effectively and timely, the junction temperature point (that is, the connection point between the LED and the substrate) will be too high, which will significantly reduce the luminous effect, r...

AI Technical Summary

Problems solved by technology

For example, the structure disclosed in the "Copper Base High-Power LED Package" with the Chinese Patent Publication No. CN101159300A has the following defects: (1) due to the different thermal expansion coefficients between the copper substrate and the aluminum casing, the contact surface between the two Cracks are easily caused by internal stress. The cracks not only form a channel for external moisture and pollutants to invade, but also greatly reduce the heat transfer area. At the same time, it will also lead to oxidation of the corresponding contact surface of the copper substrate and the aluminum shell, and then Reduce thermal efficiency

(2) Since the copper substrate and the aluminum lamp housing are usually fixed with heat-conducting glue and screws, it is inevitable that workers will have inconsistent tightening of the screws during operation, so the above-mentioned external moisture will also occur unintentionally. and the passage of pollutants intrusion

(3) The substrate is completely made of copper material, which will also increase the cost to a certain extent

[0004] The use of aluminum substrates has advantages in cooperating with heat sinks, but aluminum and current aluminum alloys are obviously insufficient in thermal conductivity, especially for high-power LED lamps, aluminum and current aluminum alloys are difficult to meet their heat dissipation requirements Require

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