Breaking apparatus for membraniform adhesive and breaking method thereof

Abstract

The invention provides a breaking apparatus for membraniform adhesive and breaking method thereof, which is able to prevent fragments generated by breaking of a probe portion of a membraniform adhesive from being adhered to surface of wafer. The breaking apparatus (1) breaks the membraniform adhesive (10) adhered on back surface of the wafer (11) when the membraniform adhesive (10) is adhered to aprotection stripe (13) mounted in an opening portion (12a) of a circular frame (12). The breaking apparatus (1) includes a frame holding element (4) for holding the circular frame (12); an extendingelement (3) for extending the protection stripe; a driving and reversing element (4) for relatively positioning holding surfaces of the extending element (3) and frame holding element (4); and a cooling element (6) for cooling the membraniform adhesive (10). The breaking apparatus (1) is equipped with a blower element (5) which injects air by way of making air flow from inner side to outer side ofthe wafer (11) to the wafer (11) when extending the protection stripe (13).

Description

technical field [0001] The present invention relates to a fracturing device and a fracturing method for fracturing a film adhesive used for mounting or laminating semiconductor chips. Background technique [0002] In the manufacturing process of semiconductor devices, a large number of circuits such as IC (integrated circuit: integrated circuit) or LSI (large-scale integration: large-scale integration) are formed on the surface of a roughly disc-shaped semiconductor wafer, and the Each region is diced in a grid pattern along predetermined streets (cutting lines), thereby manufacturing individual semiconductor chips (devices). [0003] Then, on the back surface of the separated semiconductor chip, a film-like adhesive made of a thermosetting resin such as epoxy resin and having a thickness of, for example, 20 to 100 μm is pasted, and the semiconductor chip is bonded via the film-like adhesive. agent mounted on a die-bonding frame, etc. [0004] As a method of affixing the f...

AI Technical Summary

Problems solved by technology

As in the method described in Patent Document 2, this problem can be solved by providing a cutting residue instead of completely cutting the film-like adhesive. However, in this case, in order to separate the hard semiconductor wafer and the soft The film adhesive is cut at the same time, and the cutting speed must be slowed down, resulting in a problem of low production efficiency.

[0014] In addition, in the methods described in Patent Documents 2 and 4, the film-like adhesive is broken by spreading the dicing tape, but in this method, the film-like adhesive is also stretched together with the dicing tape, and there is a film-like adhesive. Agents not breaking reliably at intended locations

On the other hand, as in the method described in Patent Document 5, if the film-like adhesive is broken while cooling, the above-mentioned problems will not occur. However, in this method, there is also the following problem: when the dicing tape is extended , the protruding part of the film adhesive is broken, and its fragments will be scattered

In addition, if cooling is performed when the film adhesive is broken, the stretchability of the protruding part will also be reduced and hardened, so when the dicing tape is expanded, it will break and its fragments will adhere to the wafer surface. or splash around

In particular, when fragments of the film-like adhesive adhere to the semiconductor chip, it will become a cause of chip failure, so it is not preferable.

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