Encapsulating method of blue-light LED chip

Abstract

The invention discloses an encapsulating method of a blue-light LED chip, which comprises the following steps: photosensitive resin liquid which is sensitive to blue light is prepared; an LED semi-finished product is presoaked in the photosensitive resin, the LED semi-finished product is then reversely soaked in the photosensitive resin liquid, the edge of a chip basal plate is immersed in the photosensitive resin, low working current is introduced to the LED chip to cause the LED chip to irradiate; the photosensitive resin is triggered to occur primary polymerization, and a photosensitive resin core is formed on a light-emitting surface of the LED chip; the LED semi-finished product is caused to slowly ascend to separate the liquid surface of the photosensitive resin, and a semispherical or approximately-semispherical photosensitive resin liquid drop is attached on the photosensitive resin core and a chip base; medium working current is introduced to the LED chip to cause the LED to irradiate so that the photosensitive resin liquid drop is excited to be solidified; high working current is introduced to a sample of the photosensitive resin liquid drop after being solidified so as to cause the LED chip to irradiate, solidification and decolorization are further carried out, or the sample is decolorized through sunshine insolation or through purple light irradiation; and finally the sample after being solidified and decolorized is cleaned.

Description

technical field [0001] The invention belongs to the technical field of packaging of light emitting diodes, and in particular relates to a packaging method of a blue LED chip. Background technique [0002] People have paid attention to the research on light-emitting diodes (LEDs), a light-emitting device that converts electrical energy into light energy. In 1993, high-brightness red and yellow LEDs began to appear. In 1995, high-brightness blue and green light-emitting diodes were successively developed. In addition to the performance, advantages and uses of ordinary LEDs, the wide-bandgap GaN-based blue and green LEDs have It also fundamentally solves the problem of lack of color in the three primary colors of LEDs, and is an indispensable key device for full-color display. On the other hand, the appearance of GaN-based LEDs makes it possible for semiconductor white light solid-state lighting, which is called a "green lighting source" and brings about a revolution in lighti...

AI Technical Summary

Problems solved by technology

Traditional packaging uses epoxy resin such as AB glue, which is packaged by heat curing. It needs to cure and post-cure the epoxy resin at a temperature higher than 100 degrees for a long time (more than 1 hour). There are many processes and low production efficiency. , long cycle and high cost

It specifically includes the following disadvantages: 1) The difficulty of process control is air bubbles, lack of material, and black spots; 2) In actual production, manual dispensing is often used, and the efficiency is low; 3) It needs molds to form, and most of them need lenses. In order to meet the optical design; 4) Large-scale industrial production requires high equipment requirements, and it is difficult for general enterprises to have enough funds to buy good equipment; 5) Thermal curing itself may affect the chip, causing the chip to be damaged due to high temperature

[0004] At present, some researchers use photosensitive resin to encapsulate light-emitting diodes to improve packaging efficiency, such as US patent 6958250, but the packaging process in this patent is similar to the current LED packaging process, which requires the use of molds

Chinese patent 200710032491.8 provides a light-curing packaging method that does not require a mold, but the shape of the lens formed by this method is not ideal, the mushroom-shaped structure is easy to fall off due to force, and is sensitive to the intensity and time of the incoming current, which is not suitable for automation. Production

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