Improved computer cooling device

Abstract

The invention discloses an improved computer cooling device which comprises at least one evaporator, a compressor, a condenser, an expanding valve, a fan and a cooling medium. The evaporator is arranged on one side of at least one heating source which is arranged in a computer host unit and can be a central processing unit; the compressor is connected with the evaporator; the condenser is connected with the compressor; the expanding valve is connected between the condenser and the evaporator; the fan is arranged on one side of the condenser; and the cooling medium is circulated among the evaporator, the compressor, the condenser and the expanding valve. Therefore, the invention enables the heating source in the computer host unit to achieve the efficacy of rapid heating source dissipation by utilizing the cooperation of the evaporator, the compressor, the condenser, the fan, the expanding valve and the cooling medium.

Description

technical field [0001] The present invention relates to an improved computer cooling device, in particular to a cooling device that uses evaporators, compressors, condensers, fans, expansion valves and refrigerants to achieve rapid heat dissipation for the heat source in the computer host unit. The improved computer cooling device. Background technique [0002] Generally, the heat dissipation structure of the existing traditional computer mainframe is to configure a heat sink on the processing chip of the motherboard, the heat sink is pasted on the processing chip, and a fan is assembled on the heat sink; the way of heat dissipation is The heat sink absorbs the hot air generated by the processing chip to expand the heat source area, and then the fan installed on the heat sink blows air to generate airflow, so that the heat flow of the heat sink flows in all directions, thereby achieving the effect of heat dissipation. [0003] However, since the inside of the computer mainf...

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Problems solved by technology

[0005] Although the above-mentioned existing conventional water cooling head structure allows the working fluid to flow into the accommodation space from the input pipe, and after absorbing heat, the working fluid is discharged from the output pipe for cooling, so as to achieve the effect of heat source dissipation; but due to its heat exchange When the input pipe and the output pipe share an accommodating space, so that the working fluid that has reacted and the working fluid that has not reacted is mixed with cold and hot liquids, and the temperature difference of heat exchange is small, which leads to heat dissipation. Poor phenomena occur; the heat dissipation device of the existing conventional water cooling head structure still cannot meet the needs of actual use

[0006] This shows that the above-mentioned existing computer cooling device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related. The problem that the industry is eager to solve

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