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Method for packaging light emitting diode

A technology for light-emitting diodes and packaging methods, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as inability to respond to design changes quickly, delaying production schedules, and deformation.

Inactive Publication Date: 2009-09-30
LEXTAR ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Whether it is compression molding or transfer molding, molds and expensive molding machines are required, which will cause a certain cost burden
In addition, the mold core may be deformed or damaged after being used for a period of time, which will change the shape of the formed encapsulant and even affect the production yield
Furthermore, since the mold opening and mold repairing require multiple rounds of testing and fine-tuning, it is impossible to quickly respond to design changes and easily delay the production schedule

Method used

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  • Method for packaging light emitting diode

Examples

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Embodiment Construction

[0025] Figure 1A ~ Figure 1E It is a schematic cross-sectional view of a light emitting diode packaging method according to an embodiment of the present invention. Please refer to Figure 1A Firstly, a light emitting diode chip 110 is bonded to a carrier 120 so that the light emitting diode chip 110 is electrically connected to the carrier 120 . The aforementioned carrier 120 generally refers to any carrier board capable of carrying the LED chip 110 and electrically connected to the LED chip 110 . In this embodiment, the carrier 120 may be a printed circuit board (Printed Circuit Board, PCB), and the printed circuit board is made of ceramic material or plastic material, for example. In addition, the printed circuit board can also be a metal core printed circuit board (Metal Core Printed Circuit Board, MCPCB) or a flexible printed circuit board (Flexible Printed Circuit) with good heat dissipation properties. In other words, the light-emitting diode 100 in this embodiment is...

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Abstract

The present invention discloses a method for packaging light emitting diode. Firstly, a light emitting diode chip is combined with a carrier so that the light emitting diode chip is electrically connected with the carrier. Secondly, the carrier is heated for increasing the temperature of carrier. Afterwards, a packaging colloid is formed through a dispensing mode for coating the light emitting diode chip, wherein the viscosity of packaging colloid when the packing colloid does not contact the carrier is lower than the viscosity when the packaging colloid contacts the carrier. Finally the packaging colloid is solidified.

Description

technical field [0001] The present invention relates to a packaging process of light emitting diode, and in particular to a packaging process of light emitting diode that can rapidly increase the viscosity of packaging colloid. Background technique [0002] Due to the advantages of long life, small size, high shock resistance, low heat generation and low power consumption, light-emitting diodes have been widely used in home appliances and indicator lights or light sources of various instruments. In recent years, due to the development of light-emitting diodes towards multi-color and high-brightness, the application range of light-emitting diodes has been expanded to large outdoor display billboards and traffic lights, etc. And the lighting source of environmental protection function. [0003] Roughly speaking, the LED packaging structure includes a carrier, a LED chip and an encapsulant. The LED chip is arranged on the carrier and electrically connected with the carrier. ...

Claims

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Application Information

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IPC IPC(8): H01L33/00
Inventor 张文松郭政达
Owner LEXTAR ELECTRONICS CORP
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