Stacked integrated circuit and manufacturing method thereof

Abstract

The present invention relates to a stacked integrated circuit and manufacturing method thereof. The formation of bonding pad protective layer over exposed bonding pad materials between stacked integrated circuit (IC) dies or wafers is described in preferred embodiments in which the bonding pad protective layer is formed in the integrated process of forming wafer bonding pads. The bonding pad protective layer prevents the exposed bonding pad materials from oxidation and corrosion in open-air or other harsh environments. By providing a bonding pad protective layer on exposed bonding pad materials, significant product reliability improvement is expected on ICs having a three-dimensional ''stacked-die'' configuration.

Description

technical field [0001] The present invention relates to the manufacture of an integrated circuit, in particular to a stacked integrated circuit and its manufacturing method related to the formation of protective layers for wafers and / or chip pads. Background technique [0002] In modern integrated circuits, the speed of operation on the integrated circuit is usually limited, among other things, by the farthest apart intercommunicating components on a chip (ie, a wafer, hereinafter referred to as a chip). As long as the vertical distance between the material layers is smaller than the chip width of the individual material layers, laying out the circuit as a three-dimensional structure has been shown to greatly shorten the communication paths of the components on the chip. Thus, by stacking circuit layers vertically, the overall chip speed is typically increased. The method that has been used to implement this stacking is through wafer bonding. [0003] Wafer bonding is usua...

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Problems solved by technology

[0006] It can be seen that the above-mentioned existing integrated circuit and its manufacturing method obviously still have inconvenience and defects in product structure, manufacturing method and use, and need to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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