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Package Structure

A packaging structure, semiconductor technology, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as difficulty in wire design

Active Publication Date: 2009-09-09
ADVANPAK SOLUTIONS PTE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, each semiconductor element has several electrical contacts. If the electrical contacts of more than two semiconductor elements are connected to the substrate, the design of wires will be a very difficult task.

Method used

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Examples

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Effect test

no. 1 example

[0058] Please refer to figure 1 , which shows a schematic diagram of the packaging structure 1000 according to the first embodiment of the present invention. The packaging structure 1000 of this embodiment includes a first semiconductor element 100, a second semiconductor element 200, a semiconductor connecting element 300 (Interposer) (the material of which includes thermoplastic resin (thermoplastic) or epoxy resin (epoxy)) and a substrate 400. The first semiconductor element 100 and the second semiconductor element 200 are, for example, memory chips, processing chips, or photosensitive chips. In this embodiment, both the first semiconductor device 100 and the second semiconductor device 200 are memory chips, and the circuit structures of the first semiconductor device 100 and the second semiconductor device 200 are the same. The material of the substrate 400 is an insulating material, such as glass fiber (FR4) or ceramic material. The semiconductor connecting element 300...

no. 2 example

[0082] Please refer to Figure 5 , which shows a top view of the package structure 2000 according to the second embodiment of the present invention. The package structure 2000 of this embodiment differs from the package structure 1000 of the first embodiment in the configuration of the power supply wire 340a, and the rest of the similarities will not be described again.

[0083] Such as Figure 5 As shown, the semiconductor connection element 300a of this embodiment includes several power supply wires 340a, and one end of each power supply wire 340a is connected to a power supply conductive bump 150 or a power supply conductive bump 250, and is adjacent to the power supply conductive bump 150 or the power supply conductive bump 250. The power conductive bump 250 is provided. The other end of each power wire 340 a is connected to each respective power conductive post 350 . In this way, the length of each power wire 340a can be shortened to the minimum, so that the impedance ...

no. 3 example

[0085] Please refer to Figure 6 , which shows a top view of the package structure 3000 according to the third embodiment of the present invention. The packaging structure 3000 of this embodiment differs from the packaging structure 2000 of the second embodiment in the number of the first semiconductor elements 100 and the number of the second semiconductor elements 200 , and the rest of the similarities will not be repeated.

[0086] Such as Figure 6 As shown, the package structure 3000 includes several first semiconductor devices 100 and several second semiconductor devices 200 . The numbers of the first semiconductor elements 100 and the second semiconductor elements 200 are the same. And the first semiconductor elements 100 correspond to the second semiconductor elements 200 one by one.

[0087] When the first semiconductor device 100 and the second semiconductor device 200 are similar, the semiconductor connection device 300b can reproduce the patterns of multiple set...

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Abstract

The invention discloses a package structure, which comprises at least one first semiconductor element, at least one second semiconductor element, a semiconductor connecting element and a substrate, wherein the first semiconductor element comprises a plurality of first conductive lugs; the second semiconductor element comprises a plurality of second conductive lugs; the semiconductor connecting element comprises a connecting mainboard, at least one signal conductor and at least a signal conductive pole; the signal conductor is arranged on the connecting mainboard; both ends of the signal conductor are respectively electrically connected with one of the first conductive lugs and one of the second conductive lugs; the signal conductive pole is electrically connected with the signal conductor; the substrate is electrically connected with the signal conductive pole; and the first semiconductor element and the second semiconductor element are storage chips with the same circuit structure. Based on the invention, the substrate of the package structure can form signal communication paths with the first semiconductor element and the second semiconductor element at the same time.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a packaging structure including a semiconductor interposer. Background technique [0002] The advent of semiconductor components is an important milestone in the development of science and technology. Among them, packaging technology plays a pivotal role in semiconductor technology. With the continuous progress of semiconductor components, the components are becoming more and more diversified, and the packaging process is becoming more and more complicated. [0003] Generally speaking, semiconductor elements are electrically connected and disposed on a substrate, and then covered by a sealant to complete a packaging structure. External signals can be transmitted to the inside of the semiconductor element through the substrate. [0004] Under the pursuit of "light, thin, short, and small" design, designers must arrange more than two semiconductor elements on the same substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/065H01L23/488
CPCH01L2224/16225H01L2224/32225H01L2224/73204H01L2924/15311
Inventor 周辉星王志坚
Owner ADVANPAK SOLUTIONS PTE
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