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Microphone encapsulation structure

A technology of packaging structure and microphone, applied in microphone structure association, transducer shell/cabinet/bracket, etc., to achieve the effect of reducing replacement cost, stable card structure and preventing short circuit

Inactive Publication Date: 2007-08-15
LINGSEN PRECISION INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to overcome the defects of the existing microphone packaging structure and provide a novel microphone packaging structure. The technical problem to be solved is to form at least A groove, which maintains a height difference between the groove and the pad on the substrate, which can avoid short circuits caused by overflowing conductive adhesive, making it more suitable for practical use

Method used

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  • Microphone encapsulation structure
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Embodiment Construction

[0069] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and effects of the packaging structure of the microphone proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , as detailed below.

[0070] Please refer to FIG. 3 , which is a three-dimensional schematic diagram of a combined structure of a package structure of a microphone according to a preferred embodiment of the present invention, wherein the bonding area of ​​the substrate is a slope inclined outward. The packaging structure of the microphone according to the preferred embodiment of the present invention includes a main body 200 , a substrate 210 , a sound processing unit 220 , solder pads 230 , wires 240 and an upper cover 260 . The upper cover 260 includes a sound hole 262 .

[00...

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Abstract

The related package structure for a microphone comprises: a base with composite welding mats and a composition face coated conductive adhesive on different planes, a speech process unit set on the base connected with mats through some wires, and a top cover fixed with said composition face. Wherein, there is at least one groove on the base to form a height difference with the mat. This invention can avoid short circuit led by overflowing adhesive, has annular electromagnetic screen effect, and wears well for practical application.

Description

technical field [0001] The invention relates to a packaging structure of a microphone, in particular to a packaging structure of a microphone which can avoid short circuit due to overflow of conductive glue. Background technique [0002] Due to the increasingly widespread application of mobile communication devices, the requirements for humanized design such as thin, light and small are also advancing with the times. Among them, various household or handheld wireless communication devices are transmitting electromagnetic signals all the time, and today's extremely popular Between the mobile phone and the common microphone in various occasions, the amplifying circuit in the microphone is often seriously interfered by the transmission of intensive signals of the mobile phone. [0003] Please refer to FIG. 1 , which is a three-dimensional schematic diagram of a combined structure of a conventional microphone package structure, wherein the bonding area of ​​the base material is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/04
Inventor 黄进清田炯岳杨席珍
Owner LINGSEN PRECISION INDS
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