Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof

A technology for cutting chips and packages, which is applied in semiconductor/solid-state device manufacturing, manufacturing tools, stone processing equipment, etc. It can solve the problems of not cutting BGA package chips, lip effect, cutting length difficult to exceed 2km, etc.

Active Publication Date: 2011-01-26
XIAN DIASH SUPERHARD MATERIALS DEV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Electroformed cutting discs are compact, hard and have a high diamond concentration (≥120%) due to the nickel-based matrix matrix, and due to technical limitations, they can only be embedded with solidified fine diamond particles (≤15μm). Many factors affect the comprehensive The wear resistance of this type of cutting disc is improved, which is reflected in the slow radial consumption during cutting, and the wear on both sides is slightly faster, which is prone to dagger-shaped cutting edge cutting shape, resulting in chip size exceeding the tolerance requirement, and lip effect in severe cases
[0013] The overall performance is in a dull state, and the cutting resistance increases significantly, causing deformation and distortion of the force-bearing surface of the chip, and the overall deviation until it is detached from the fixation, and the shape specification and dimensional accuracy cannot be guaranteed.
To sum up the adverse effects, the safe cutting length of the online test is difficult to exceed 2km, which is far from the market demand. Although it is used occasionally, it is no longer the mainstream of cutting BGA packaged chips.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof
  • Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof
  • Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] (1) Raw materials: prepare the metal-based carcass according to the following parts by weight ratio, that is, 35 parts by weight of Cu, 5 parts by weight of Sn, and 35 parts by weight of CuSn 20 , 5 parts by weight Co, 5 parts by weight Ni, 5 parts by weight Al 2 o 3 , 10 parts by weight of SiC, and 1 part by weight of graphite. First, wet mix and stir each component material in a vortex mixer for 4-6 hours, then add the sieved and descaled diamond particles, and stir for about 1 hour to obtain a uniform mixture, or the mixture can be passed through the granulation process A granular bonded body with an outline of less than 1mm is made. The diamond particle size is 40μm and the concentration is 70%;

[0070] (2) Cold press preforming: the mixture or granulated material is supplemented with an appropriate amount of forming agent or lubricant, and is evenly distributed in the steel mold space. After sealing, put it on the lower platen of the press, and slowly lift it t...

Embodiment 2

[0077] (1) Material preparation: according to 78 parts by weight of Cu, 22 parts by weight of Sn, plus 1 part by weight of Al 2 o 3 , 1 weight part of SiC, 1 weight part of graphite to prepare metal carcass raw materials. First, mix the above raw materials in a vortex mixer for 4-6 hours, then add the sieved and descaled diamond particles, stir for about 1 hour to obtain a uniform mixture, and then pass the granulation process to make the mixture with a shape less than 1mm of granular adhesives. The diamond particle size is 50μm and the concentration is 55%;

[0078] (2) Cold press preforming: the mixture or granulated material is supplemented with an appropriate amount of forming agent or lubricant and evenly distributed in the steel mold space. After sealing, put it on the lower platen of the press, and slowly lift it to contact with the upper platen. and apply pressure

[0079] 3.92×10 3 -5.88×10 3 MPa and hold the pressure in a timely manner to obtain a formed compac...

Embodiment 3

[0087] (1) material preparation: according to 50 parts by weight of CuSn 20 , 38 parts by weight of Cu, and 12 parts by weight of Sn to prepare a metal-based carcass. Stir the above raw materials in a vortex mixer for 4-6 hours, then add the sieved and descaled diamond particles, stir for about 1 hour to obtain a uniform mixture, and then pass the mixture through the granulation process to make a shape less than 1mm granular adhesive. The diamond particle size is 55μm and the concentration is 55%;

[0088] (2) Cold press preforming: the mixture or granulated material is supplemented with an appropriate amount of forming agent or lubricant, and is evenly distributed in the steel mold. After sealing the cover, put it on the lower platen of the press, and slowly lift it to contact with the upper platen. Apply pressure 3.92×10 3 -5.88×10 3 MPa and hold the pressure at the right time to obtain the formed green compact. After inspecting the defects of delamination, cracks, edge ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
hardnessaaaaaaaaaa
Login to view more

Abstract

The invention discloses a thin metal base diamond composite material cutting disk in order to meet the requirement of cutting a BGA encapsulation body of an organic laminated board of a semiconductor chip in a sawing manner. Detailed description is made in the invention with respect of composition design, preparation technology, forming technology, precision work and the like of the cutting disk.According to the technical proposal provided by the invention and the manufacture process designed by the invention, a diamond is selected for cutting. Centering on a holding mechanism that combines the construction and particle firmness thereof, selections of different composition formulas of tire carcasses are respectively given. The cutting disk is prepared under the conditions of hot pressed sintering or braze welding technology, which not only improves the combination form of metal tire carcasses and diamond particles so as to enhance the holding force and the continuous self-sharpening capacity, but also establishes matching wear relation between the radial direction and both sides so as to form a approximately flat cutting appearance at a blade end, thereby ensuring that the cutting length is greatly improved on the basis of guaranteeing the high-precision cutting quality of the chips, and being beneficial to the significant reduction of production cost.

Description

technical field [0001] The invention belongs to the technical field of new materials and is used in the manufacturing industry of superhard material products or tools, in particular to an ultra-thin metal-based diamond cutting sheet used in the singulation and division of chips and a manufacturing method thereof. Background technique [0002] Ball grid array BGA (Ball Grid Array) packaging, as the mainstream technology in the field of semiconductor high-end packaging and testing, has been widely used in FBGA (Fine Pitch BGA), FCBGA (Flip Chip BGA), PBGA (Plactic BGA), SiP (System in Package), MCM / MCP (Multi Chip Module / Multi Chip Package), CSP (Chip Scale / Size Package) and other forms of IC chip back-end packaging, the essence of which is to make solder balls arranged in a matrix at the bottom of the packaging substrate As the I / O terminal of the circuit, it is easy to perform surface mount interconnection with the printed circuit board of the terminal equipment. [0003] T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/78B28D5/00
Inventor 南俊马徐可为
Owner XIAN DIASH SUPERHARD MATERIALS DEV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap