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Encapsulating material applied to LED and method of preparing the same

A technology of light-emitting diodes and packaging materials, applied in chemical instruments and methods, other chemical processes, electrical components, etc., can solve problems such as stability, transparency reduction, unfavorable colloid potting operation, poor colloid yellowing resistance, etc., to achieve durability Good yellowing property, good for long-term use stability, and high transparency

Active Publication Date: 2009-08-19
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Chinese patent CN101003686A discloses a composition applicable to high-power LED packaging. The composition is a curable silicone rubber composition composed of organic polyoxyalkylene with aliphatic unsaturated bonds, organic polyoxyalkylene with three-dimensional network structure It is composed of siloxane, organohydrogen polysiloxane and platinum group metal-based catalyst, but the composition still has the following disadvantages for high-power LED packaging: 1. After curing, the yellowing resistance of the colloid is poor, and the stability after long-term use 1. The transparency is reduced; 2. The service life of the colloid after mixing is very short, which is not conducive to the filling and sealing operation of the colloid

Method used

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  • Encapsulating material applied to LED and method of preparing the same
  • Encapsulating material applied to LED and method of preparing the same
  • Encapsulating material applied to LED and method of preparing the same

Examples

Experimental program
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Effect test

Embodiment 1

[0030] The preparation method of the encapsulation material applied to light-emitting diodes comprises the following steps:

[0031] (1) Dissolve 5g of vinyl silicone resin in 100g of xylene, and stir until all vinyl silicone resin is dissolved in xylene to form a solution; the structural formula of vinyl silicone resin used is (Me 3 SiO 0.5 ) 39 (Me 2 ViSiO 0.5 ) 2 (SiO 2 ) 51 (where Me represents methyl, Vi represents vinyl);

[0032] (2) Dissolve 100g of vinyl siloxane in 100g of xylene and stir until all vinyl siloxane is dissolved in xylene to form a solution; the structural formula of vinyl siloxane used is

[0033]

[0034] where m=100, n=3

[0035] (3) The solution obtained in step (1) is mixed with the solution obtained in step (2), and stirred evenly, then xylene is removed therein to form 105g liquid;

[0036] (4) The liquid obtained in step (3) is mixed with 0.02g inhibitor (both methylpentynyl alcohol), 0.5g platinum acid vinyl siloxane complex with a ...

Embodiment 2

[0042] The preparation method of the encapsulation material applied to light-emitting diodes comprises the following steps:

[0043] (1) Dissolve 30g of vinyl silicone resin in 100g of toluene, and stir until all vinyl silicone resin is dissolved in toluene to form a solution; the structural formula of vinyl silicone resin used is (Me 3 SiO 0.5 ) 25 (Et 2 ViSiO 0.5 ) 4 (SiO 2 )51 (where Me represents methyl, Et represents ethyl, Vi represents vinyl);

[0044] (2) Dissolve 100g vinyl siloxane in 200g toluene and stir until all vinyl siloxane is dissolved in toluene to form a solution; the structural formula of vinyl siloxane used is

[0045]

[0046] where m=11, n=3

[0047] (3) Mix the solution obtained in step (1) with the solution obtained in step (2), and stir evenly, then remove the toluene therein to form 130g of liquid;

[0048] (4) the liquid that step (3) obtains is mixed with the isopropanol complex of chloroplatinic acid of 3000ppm with the content of 0.1g...

Embodiment 3

[0054] The preparation method of the encapsulation material applied to light-emitting diodes comprises the following steps:

[0055] (1) Dissolve 50g vinyl silicone resin in 100g xylene, and stir until all vinyl silicone resin is dissolved in xylene to form a solution; the structural formula of vinyl silicone resin used is (Me 3 SiO 0.5 ) 46 (Me 2 ViSiO 0.5 ) 4 (SiO 2 ) 51 (where Me represents methyl, Vi represents vinyl);

[0056] (2) Dissolve 100g of vinyl siloxane in 300g of xylene and stir until all vinyl siloxane is dissolved in xylene to form a solution; the structural formula of vinyl siloxane used is

[0057]

[0058] where m=800, n=7

[0059] (3) Mix the solution obtained in step (1) with the solution obtained in step (2), and stir evenly, then remove xylene therein to form 150g of liquid;

[0060] (4) the liquid that step (3) obtains and 0.32g inhibitor (both tetravinyltetramethylcyclotetrasiloxane), 1.6g platinum are 3000ppm chloroplatinic acid maleic ac...

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Abstract

The invention relates to an encapsulating material applied for an LED, which comprises the components proportioning by weight: 100 parts of ethylene siloxane, 5-80 parts of ethylene silicone, 0.01-1 part of inhibitor, 0.05-3 parts of platinic chloride complex compound and 5-50 parts of organo-silicone with Si-H bond. The encapsulating material provided by the invention has long service life and is beneficial to actual use after being mixed; after solidification, the obtained condensate has high transparence, good yellowing resistance and no surface viscosity, so as not to adhere to dust; the condensate is higher in mechanical strength, and has the tensile strength being 2-6MPa, hardness being 40-70 (shore A) and the bonding strength being 1-3 MPa. Therefore, the encapsulating material can provide good mechanical protection for the LED, thereby being beneficial for the stability of life-time service of the LED and not affecting the service life of the LED.

Description

technical field [0001] The invention relates to a packaging material applied to a light emitting diode (LED) and a preparation method of the packaging material. Background technique [0002] The packaging materials of light-emitting diodes (LEDs) mainly include epoxy resin and silicone materials. [0003] Epoxy resin has general high temperature heat resistance and poor UV resistance. With the prolongation of use time, epoxy resin will gradually turn yellow and the light transmittance will decrease, which will affect the service life and light output efficiency of LED; at the same time, the environmental protection Oxygen resin has low moisture resistance, and moisture can easily enter the interior of the component, causing a short circuit and burning the component. In addition, the curing agent of some epoxy resins contains sulfur, which is easy to pollute the environment and is not conducive to environmental protection. The above-mentioned problems restrict the applicati...

Claims

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Application Information

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IPC IPC(8): C09K3/10C08L83/07H01L23/29
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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