Method for preparing pile face zinc oxide transparent conductive film coating glass by plasma bombardment
A plasma, transparent and conductive technology, applied in the direction of ion implantation plating, sputtering plating, vacuum evaporation plating, etc., can solve the problems of limited use, air pollution, high price, etc., to increase absorption and improve conversion rate , the effect of increasing the light path
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Embodiment 1
[0024] Embodiment 1: High-purity argon is used as the working gas for plasma and sputter coating.
[0025] 1) First, the glass substrate to be coated is cleaned and dried;
[0026] 2) Put the dry glass substrate on the back and the vacuum is ≤2.5X10 -3 Pa's vacuum chamber. The vacuum chamber has a plasma generation source and a sputtering target (aluminum-doped ZnO target with a relative density > 95%) is installed.
[0027] 3) In a high-purity argon environment of 0.03Pa, the argon gas was ionized with a voltage of 2000V; under the conditions of a focusing voltage of 1500V and an argon ion beam current of 100μA, the glass surface was bombarded with plasma for 3 minutes.
[0028] 4) In a high-purity argon environment of 0.35Pa, SiO is plated 2 The transition layer is isolated with a film thickness of 30nm.
[0029] 5) Under the high-purity argon atmosphere of 0.35Pa, in SiO 2 The ZnO thin film is sputtered on the isolation transition layer.
[0030] 6) In a high-purity a...
Embodiment 2
[0032] Embodiment 2: High-purity argon is used as the working gas for plasma and sputter coating.
[0033] 1) First, the glass substrate to be coated is cleaned and dried;
[0034] 2) Place the dry glass substrate on the backside with a vacuum of ≤2.5 X 10 -3 Pa's vacuum chamber. The vacuum chamber has a plasma generation source and a sputtering target (aluminum-doped ZnO target with a relative density > 95%) is installed.
[0035] 3) In a high-purity argon environment of 0.08Pa, the argon gas was ionized with a voltage of 2400V; under the conditions of a focusing voltage of 1800V and an argon ion beam current of 130μA, the glass surface was bombarded with plasma for 3 minutes.
[0036] 4) In a high-purity argon environment of 0.35Pa, SiO is plated 2 The transition layer is isolated with a film thickness of 40nm.
[0037] 5) In the high-purity argon environment of 0.35Pa, the SiO 2 The ZnO thin film is sputtered on the isolation transition layer.
[0038] 6) In a high-pu...
Embodiment 3
[0040] Embodiment 3: High-purity argon is used as the working gas for plasma and sputter coating.
[0041] 1) First, the glass substrate to be coated is cleaned and dried;
[0042] 2) Place the dry glass substrate on the backside with a vacuum of ≤2.5 X 10 -3 Pa's vacuum chamber. The vacuum chamber has a plasma generation source and a sputtering target (aluminum-doped ZnO target with a relative density > 95%) is installed.
[0043] 3) In a high-purity argon environment of 0.1Pa, argon is ionized with a voltage of 3000V; under the conditions of a focusing voltage of 2800V and an argon ion beam current of 330μA, the glass surface is bombarded with plasma for 3 minutes.
[0044] 4) In a high-purity argon environment of 0.35Pa, SiO is plated 2 Isolate the transition layer with a film thickness of 50nm.
[0045] 5) In the high-purity argon environment of 0.35Pa, the SiO 2 The ZnO thin film is sputtered on the isolation transition layer.
[0046]6) In a high-purity argon envir...
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