Invisible fastness anti-tarnishing layer for silver coin surface and preparation method
A silver coin and aluminum target technology, which is applied to coins, ion implantation plating, applications, etc., can solve the problems of short protection time, changing the metal texture of silver coins, and being invisible, achieving low cost, maintaining the metal texture, and simple and easy process operation line effect
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Embodiment 1
[0027] The preparation method of the aluminum oxide invisible anti-tarnish protective layer on the surface of the silver coin is realized through the following steps: (1) cleaning of the silver coin: at room temperature, the silver coin is ultrasonically cleaned in absolute ethanol for 2 times, each time for 5 minutes, and the second cleaning After the completion, dry the silver coins with hot air; (2) put the silver coins into the vacuum chamber, and vacuum the back to 0.005Pa; (3) Clean the aluminum target: pass high-purity Ar gas with a purity of 99.99% into the vacuum chamber , so that the air pressure is 0.4Pa, a 700V negative bias is applied on the magnetron sputtering target, the excitation current is changed in sequence according to 500, 400, and 300mA, the sputtering current is 400mA, and each excitation current is cleaned for 20 minutes to ensure the surface of the aluminum target The natural oxide film of the silver coin is removed by sputtering cleaning. The purity ...
Embodiment 2
[0029] The difference between this implementation step and Example 1 is that implementation step (4) deposits the invisible aluminum oxide protective layer: the silver coin is heated to 300°C, the baffle plate in front of the aluminum target is removed, and Ar gas and O are introduced into the vacuum chamber. 2 Gas mixed gas, the gas flow ratio is 10:1, the vacuum chamber pressure is 0.3Pa, a 300V negative bias is applied on the magnetron sputtering target, the excitation current is adjusted to 500mA, the sputtering current is 400mA, and the deposition time is 1min, a negative bias of 50V was applied to the silver coin during the deposition process. Other steps are the same as in Example 1.
Embodiment 3
[0031] The difference between this implementation step and Example 1 lies in the implementation step (4) deposition of an invisible aluminum oxide protective layer: the silver coin is heated to 400 ° C, the baffle in front of the aluminum target is removed, and Ar gas and O are introduced into the vacuum chamber. 2 Gas mixed gas, the gas flow ratio is 10:1, the vacuum chamber pressure is 0.3Pa, a 1000V negative bias is applied on the magnetron sputtering target, the excitation current is adjusted to 500mA, the sputtering current is 400mA, and the deposition time is 3min, a negative bias of 50V was applied to the silver coin during the deposition process. Other steps are the same as in Example 1.
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