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Processing container an plasma processing device

A technology for processing containers and plasma, which is applied in the fields of plasma, semiconductor/solid-state device manufacturing, discharge tubes, etc., can solve problems such as heavy burden and increased component consumption, and achieve the effect of reducing costs and facilitating replacement operations.

Active Publication Date: 2009-06-10
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the work time and the consumption of parts caused by the gasket increase, resulting in a large burden

Method used

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  • Processing container an plasma processing device
  • Processing container an plasma processing device
  • Processing container an plasma processing device

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Effect test

no. 1 approach

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Here, a substrate processing system including the processing container according to the first embodiment of the present invention will be described as an example. figure 1 is a perspective view briefly showing a vacuum processing system 100 as a substrate processing system; figure 2 This is a plan view schematically showing the interior of each chamber with a lid (not shown) in an open state. The vacuum processing system 100 has a multi-chamber structure including processing chambers 1a, 1b, and 1c. The vacuum processing system 100 is configured, for example, as a processing system for performing plasma processing on a glass substrate (hereinafter, simply referred to as "substrate") S for FPD. Among them, examples of the FPD include a liquid crystal display (LCD), an electroluminescence (EL) display, a plasma display panel (PDP), and the like.

[0062] In th...

no. 2 approach

[0114] Next, refer to Figure 6 ~ Figure 11 , the second embodiment of the present invention will be described. Image 6 It is a schematic diagram showing the inside of the processing container according to the second embodiment of the present invention. Here, the inner wall surfaces of the side wall 101 b having the substrate transfer opening 161 and the side wall 101 c having the window opening 163 of the processing container 101 are shown.

[0115] The inner surface of the side wall 101b having the substrate transfer opening 161 is covered with a plate-shaped main pad 211 as a first protection member, thereby being protected from plasma and corrosive gas. The main pad 211 has an opening corresponding to the size of the substrate transfer opening 161 .

[0116] Around the corners 161a at both ends of the substrate transfer opening 161, auxiliary pads 301a and 301b as second protective members, which are formed in smaller pieces than the main pad 211, are stacked on the mai...

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Abstract

The present invention provides a processing container and a plasma processing device, capable of exchanging a protective member for protecting inner surface of the processing container easily in the plasma processing device, and restraining cost of members. In the processing container (101) of the plasma processing device, the inner surface with side wall (101b) with opening (161) for conveying substrates is covered with pads (201a,201b, 201c, 201d) as protective member. Because plasma concentrated at a corner portion (161a) of the opening (161) for conveying substrates is easy to consume, the surrounding pads (201a, 201c) are configured to be separable to the pads (201b, 201d) with slower consumption than the pads (201a, 201c) in manner of independent members.

Description

technical field [0001] The present invention relates to a processing container for accommodating an object to be processed when performing plasma processing on an object to be processed such as a glass substrate for a flat panel display (FPD), and a plasma processing apparatus including the processing container. Background technique [0002] In the manufacturing process of FPDs represented by liquid crystal displays (LCDs), various processes such as etching and film formation are performed on objects to be processed such as glass substrates in a vacuum state. In order to perform the above-mentioned processing using plasma, a plasma processing apparatus having a processing container capable of being evacuated is used. [0003] In a plasma processing apparatus, the inner surface of a metal processing container may be damaged by the action of plasma and corrosive gas. Therefore, for example, anodizing treatment (aluminite treatment) is performed on an aluminum processing conta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/00H05H1/00
CPCH01J37/32477H01J37/32743H01J37/32633
Inventor 东条利洋田中诚治出口新悟
Owner TOKYO ELECTRON LTD
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