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Integrated circuit suitable for various encapsulation modes

A technology of integrated circuits and packaging modes, which is applied in the field of integrated circuits with various packaging modes, and can solve the problems that the development and production costs of microchips cannot be effectively saved.

Active Publication Date: 2009-05-27
REALTEK SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, one of the objects of the present invention is to provide an integrated circuit suitable for multiple packaging modes, so as to solve the problems disclosed in the prior art that cannot effectively save the development and production costs of microchips

Method used

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  • Integrated circuit suitable for various encapsulation modes
  • Integrated circuit suitable for various encapsulation modes
  • Integrated circuit suitable for various encapsulation modes

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Embodiment Construction

[0133] Specific embodiments are given below to describe the content of the present invention in detail, and the accompanying drawings are used as auxiliary descriptions. The symbols mentioned in the description are reference figures.

[0134] Referring to FIG. 3 , it is an integrated circuit 200 according to an embodiment of the present invention, which is applicable to various types of packaging, such as single microchip packaging, multi-microchip packaging, and the like. The integrated circuit 200 includes: a core circuit 210 , a plurality of bonding pads 230 , 250 , a selection circuit 270 and a control circuit 290 .

[0135] Here, the core circuit 210 refers to the circuit part used to provide the main core functions of the integrated circuit. Generally speaking, the core circuit 210 will have one or more signal input / output signals. In this embodiment, in order to be applicable to various packaging modes, the signal input terminal is coupled to the selection circuit 270,...

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Abstract

The invention provides an integrated circuit applicable to a plurality of encapsulation modes. The integrated circuit comprises a core circuit, a plurality of joint sheets and a selection module, wherein the selection module is coupled among the core circuit and the plurality of the joint sheets, and comprises a plurality of option circuits for determining a conduction state of the core circuit with the plurality of the joint sheets through the selection module according to a control signal. When the control signal is of a first numerical value, the core circuit and the plurality of the joint sheets are in a first conduction state, the integrated circuit is used in encapsulating of a mono-microchip, while the control signal is of a second numerical value, the core circuit and the plurality of the joint sheets are in a second conduction state, and the integrated circuit is used in encapsulating of multi-microchip.

Description

technical field [0001] The present invention relates to an integrated circuit, especially an integrated circuit suitable for multiple packaging modes. Background technique [0002] In recent years, integrated circuits (integrated circuits; ICs) are constantly moving toward miniaturization and integration. It is one of the goals of IC development to integrate multiple functions in a single IC so that it has the ability to be systematized. However, integrating multiple functions of an IC may result in complex manufacturing steps and an excessively large die area, which in turn leads to a lower product yield. Therefore, the two functions with large manufacturing differences or difficult to integrate are divided into different microchips, and then multi-die packaging technology is used to package a variety of microchips with different functions in one package to achieve Systematic purpose. [0003] Please refer to FIG. 1 , which shows a known single-die package structure. Th...

Claims

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Application Information

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IPC IPC(8): H01L27/02H01L23/50
CPCH01L2224/023H01L2224/05554H01L2224/48145H01L2224/48247H01L2224/49171H01L2224/49175H01L2924/00H01L2924/00012H01L2924/0001
Inventor 张贤钧洪嘉隆林宗祺林佐柏
Owner REALTEK SEMICON CORP
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