Circuit board element dismounting device
A technology for circuit boards and components, applied in the field of electronic waste recycling, can solve the problems of unreasonable structure and configuration of the desoldering device, and achieve the effects of high removal rate, small temperature attenuation, and small gas pressure loss
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[0036] Referring to Fig. 1, after the circuit board 16 to be disassembled is clamped and fixed, it is transported to the preheating device 2 by the clamping and conveying mechanism 7 through the entrance 1 of the heat preservation chamber, and the whole is heated by the combination of the resistance wire or the infrared heating plate in the preheating device 2 and the hot air. Preheat the circuit board to 140~180°C
[0037] The preheated circuit board 16 can be sent to the heating device 3 to heat the circuit board 16 . The heating device 3 is composed of a solder melting tank 30 placed below the clamping and conveying mechanism 7. The molten solder 4 in the solder melting tank 30 is in contact with the soldering surface of the circuit board 16, and the soldering surface of the circuit board 16 is heated until the solder melts. If after entering the desoldering device below, the temperature of the high-temperature and high-pressure gas is high enough and the running speed of t...
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