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Technique and device for effectively recovering waste printed circuit boards solder

A printed circuit board, soldering technology, applied in the new process field of recycling waste printed circuit board solder, can solve problems such as technical and economic constraints, and achieve the effects of easy control of conditions, no secondary pollution, and high energy utilization rate

Inactive Publication Date: 2009-02-11
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, the recycling technology of waste printed circuit board solder is in the feasibility study stage, and its development is restricted by many aspects such as technology and economy.

Method used

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  • Technique and device for effectively recovering waste printed circuit boards solder
  • Technique and device for effectively recovering waste printed circuit boards solder
  • Technique and device for effectively recovering waste printed circuit boards solder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Load the waste circuit board, the oil temperature is 235°C, rotate for 5 minutes, the result is as follows figure 2 Shown:

[0049] Experimental results: Some electronic components fell off, but a large number of electronic components were attached to the circuit board; some tin fell off, but some tin remained in the soldering holes.

Embodiment 2

[0051] After loading the sample, the oil temperature is 240°C, and the oil is rotated twice for a total of 10 minutes. The results are as follows: image 3 Shown:

[0052] Experimental results: Most of the electronic components fell off, but there were still electronic components attached to the circuit board; a large amount of tin fell off, but a small amount of tin remained in the solder holes.

Embodiment 3

[0054] After loading the sample, the oil temperature is 240°C, rotate three times for a total of 15 minutes, and heat to 240°C before each rotation to stabilize, the results are as follows Figure 4 Shown:

[0055] Experimental results: Most of the electronic components fell off, but there were still very few electronic components attached to the circuit board; a large amount of tin fell off, but there was still a small amount of tin remaining in the soldering holes.

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PUM

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Abstract

The invention relates to a technology for high-efficiently recycling soldering tin of discarded printed circuit boards, and a device. In a sealed system, in which liquid heat conducting medium exists, discarded printed circuit boards to be processed and welded with electronic parts are put in a swivel which is provided with a plurality of filtering holes and immersed in the heat conducting medium, the temperature is risen until the soldering tin is melted, after the temperature is constant, the swivel is rotated to centrifugally separate solid and liquid, the soldering tin leaks from the filtering holes, deposits at the bottom and is cooled into ingot, and the electronic parts are separated from the discarded printed circuit boards correspondingly. The method for recycling the soldering tin of discarded printed circuit boards has no environmental pollution, low energy consumption and high efficiency, and can create good condition for high-efficiently recycling other metals.

Description

technical field [0001] The invention belongs to the technical field of resource recovery and reuse of waste electronic and electrical products, and relates to a new process for recycling waste printed circuit board solder. Background technique [0002] The present invention is a process for recycling solder in a large number of waste printed circuit boards (printed circuit board, PCB) researched and developed at present. As we all know, with the rapid development of the economy and the electronic information industry, the replacement of electronic and electrical products is increasing, and the service life of products is shortened, resulting in a large number of electronic products being discarded. Waste printed circuit boards are a major part of electronic waste, and their recycling has become a global problem that needs to be solved urgently. Waste printed circuit boards contain a large amount of solder, which has valuable recycling value. The recycling of solder has beco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00B23K1/018B23K3/00
CPCY02P70/10Y02W30/82
Inventor 丘克强周益辉
Owner CENT SOUTH UNIV
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