Two-board-in-one processing method for substrate manufacture of printed circuit board or integrated circuit package

Abstract

Disclosed is a method for combining two plates in the fabrication process of an enclosure baseplate of a printed circuit or an integrated circuit. The method includes the following steps: splicing two chip plates through a bonding sheet so as to make a machining plate which is big in thickness, higher in rigidity and can satisfy common equipment machining requirements; processing pattern transfer to the spliced machining plate and developing a necessary circuit diagram of a conductor on the surface of the machining plate; developing an insulating medium layer and a conducting copper layer on the surface of the newly developed circuit diagram of the conductor through the method of lamination; repeating above processes so as to form a multilayer machining plate; separating the machining plate at two sides of the splicing sheet from the splicing sheet after the machining plate reaches certain thickness and rigidity, thus forming two machining plates; and respectively processing the two machining plates through regular lamination, boring, electroplating and pattern transfer techniques until the necessary circuit board and the enclosure baseplate are finished. The method requires no special equipment or machining tools and can reduce cost by a large margin and improve production efficiency and yield.

Description

technical field [0001] The invention relates to the manufacturing technology of printed circuit boards or semiconductor integrated circuits, in particular to a processing method for combining two boards into one during the manufacturing process of printed circuit boards or semiconductor integrated circuit packaging substrates. Processing and fabrication of interconnected printed circuit boards or semiconductor integrated circuit packaging substrates. Background technique [0002] With the vigorous development of the electronic industry, electronic products have entered the stage of functional and intelligent research and development. In order to meet the development needs of high integration, miniaturization and miniaturization of electronic products, printed circuit boards or semiconductor integrated circuit packaging substrates are used in Under the premise of satisfying the good electrical and thermal performance of electronic products, it is also developing towards the d...

AI Technical Summary

Problems solved by technology

In order to reduce the overall thickness of the circuit board and substrate after completion, when the dielectric layer of the core board is thin, such as as low as below 50um, special and expensive ultra-thin core board processing equipment must be used for processing, and the production cost will increase significantly

The industry also adopts the frame on the vertical production line and the method of using the guide plate on the horizontal production line to process ultra-thin core boards on conventional equipment to avoid problems such as bending, breaking or jamming, but these methods have complex operations and high efficiency. And the disadvantages of low yield

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