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Image processing process of full-automatic lead wire bonding machine image processing system

A wire bonding machine and image processing technology, applied in image data processing, image enhancement, image analysis, etc., can solve problems affecting image quality, difficulty in image processing, inconsistency between imaging system and ideal pinhole model, etc., to achieve automatic Alignment, the effect of improving alignment and positioning speed

Inactive Publication Date: 2009-01-07
THE 45TH RES INST OF CETC
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  • Summary
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AI Technical Summary

Problems solved by technology

[0004] When the CCD camera uses the lens optics for image acquisition, due to the influence of the three-dimensional space position relationship between the object and the camera, lens distortion and camera quality, the imaging system is inconsistent with the ideal pinhole model, and the collected images have geometric distortion. Especially when using a wide-angle lens, radial distortion will seriously affect the image quality and bring difficulties to image processing

Method used

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  • Image processing process of full-automatic lead wire bonding machine image processing system
  • Image processing process of full-automatic lead wire bonding machine image processing system
  • Image processing process of full-automatic lead wire bonding machine image processing system

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Embodiment Construction

[0023] Just operate according to the technical solution in the summary of the invention above.

[0024] Once the pin feature points and chip feature points are identified, the system will automatically calculate the chip loading error and pin error, and correct the distance between the inner solder joint and the outer solder joint. According to the position difference, the workbench is adjusted by the control card of the motion control system of the wire bonding machine, and the distance between the inner soldering point and the outer soldering point on the integrated circuit is determined. In addition, the distance between the inner solder joints on the chip and the outer solder joints on the pins is not affected by chip mounting errors and pin errors. Therefore, all kinds of data required to realize fully automatic wire bonding have been determined. At this point, the position of the chip is precisely positioned, and the wire bonding machine can complete the precise bonding...

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Abstract

The invention relates to an image processing method of a full automatic wire bonder image processing system. The steps of the invention are that: (1) the collected images are calibrated; the calibration algorithm adopts standard checkerboard grid; the best fit algorithm is used for establishing a lookup table of feature points which are regularly distributed on the surface of the images; the feature points are found and analyzed, the deflection is calculated, then the feature points are amended; (2) by adopting different identification and positioning processes for the feature points of pins and chips, the distinguish of the geometric size, shape, location, and the like, is obtained; the location dispersion of the chips and the pins is accurately measured. The invention has the beneficial effects that the problem of the automatic alignment of the wire bonder is better resolved, and the image processing method of the invention further improves the speed and accuracy of alignment and position as well as consistency.

Description

technical field [0001] The invention relates to an image processing method of an image processing system of a fully automatic wire bonding machine. Background technique [0002] In recent years, with the advancement of integrated circuit technology, integrated circuit packaging has also been greatly developed. Package miniaturization is an important aspect to realize the development of miniaturization. Wire bonding is currently the most commonly used chip connection technology, and it has occupied the microelectronics packaging market due to its characteristics such as the lowest cost of a single connection, flexible manufacturing process, and strong adaptability. Fully automatic wire bonding machine is one of the most critical equipment in the post-packaging process of LED and IC semiconductors, and the image processing system is the core technology of this equipment. [0003] For fully automated wire bonding, finding where the chip sticks to the case, ie auto-alignment, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T5/00H01L21/68H01L21/60
CPCH01L2924/0002
Inventor 王镇清李久芳
Owner THE 45TH RES INST OF CETC
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