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Wire sheath construction of movable accessory and manufacturing method thereof

A technology for accessories and wire sleeves, applied in the field of mobile accessories wire sleeve structure and its manufacturing method, can solve the problems of easy to hide dirt, limited tensile effect, difficult to step into the class of high-quality products, etc. The effect of removing dirt, improving the service life, and having great industrial utilization

Inactive Publication Date: 2010-06-09
MERRY ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of wire sheath 5 with holes is a soft material, and it is directly set outside the wire 3, so when it is pulled by an improper external force, the soft wire sheath 5 with mesh holes is easy to be pulled along with the wire 3. Pulling out the microphone 1 will of course cause the wire 3 on the circuit board to be torn off, and the tensile effect is limited
In addition, the outer surface of the wire cover 5 with mesh holes is designed in a concave-convex shape, so it is easy to hide dirt and dirt. For electronic products that are often accompanied by users, this shortcoming easily makes the product be evaluated as a low-grade design. It is difficult to step into the class of high-quality products
[0004] And aforementioned defect, for earphone 2 and plug 4, it also has identical defect to exist, has the necessity of improvement equally

Method used

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  • Wire sheath construction of movable accessory and manufacturing method thereof
  • Wire sheath construction of movable accessory and manufacturing method thereof
  • Wire sheath construction of movable accessory and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0043] The above and other technical features and advantages of the present invention will be described in more detail below in conjunction with the accompanying drawings.

[0044] refer to image 3 , is the production flow chart of the first embodiment of the wire cover of the mobile accessory of the present invention. The mobile accessory 90 in this embodiment is implemented as a microphone, so it will be represented as a microphone wire cover in the following. The manufacturing process of the line cover of the mobile accessory 90 is carried out according to the following steps.

[0045] Injecting the outer mold: first, inject an outer mold 10 structure in the mold, refer to Figure 4 and Figure 5 The shape of the outer mold 10 is trumpet-shaped, one end of which is concavely provided with a joint portion 11 , and the outer mold 10 is also provided with a notch 12 on one side of the joint portion 11 .

[0046] On the contrary, the outer mold 10 forms an elongated extens...

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Abstract

The invention relates to a clip structure of a mobile accessory and the manufacturing method thereof. The structure comprises a wire rod, an internal mold which covers the wire rod, and an external mold which covers the internal mold. Through processing and manufacturing, the hard internal mold and the soft external mold can be combined closely and can not be separated easily, and the wire can undertake severe bending test and the tensile capacity thereof can be improved. The structure of the invention can provide an extensive part with a smooth and flat surface, with no net hole design, thusno dirt is hidden and contained; in addition, the internal mold can cooperate mutually with the mobile accessory to reach an excellent fixing effect. Therefore, the structure of the invention is a design with high quality and capability to extend service life.

Description

technical field [0001] The invention relates to a wire cover structure of a mobile accessory and a manufacturing method thereof, in particular to a wire cover structure and a manufacturing method of a mobile accessory with a smooth and flat appearance, good bending resistance and tensile resistance. Background technique [0002] Please refer to figure 1 , is the first existing mobile accessory structure, which has a microphone 1, one end of the microphone 1 is connected to an earphone 2, and the other end is directly connected to a plug 4 with a wire 3. When the microphone 1 is pulled by an improper external force, it is easy to cause a disconnection between the electric wire 3 and the circuit board inside the microphone 1 . In addition, the wire 3 connected to the microphone 1 is also prone to breakage due to excessive bending, and its service life is usually quite short, so it cannot be widely used in industries. [0003] refer to figure 2 , is the second existing mobi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/00H01R43/18H01R13/58H01R13/56H05K7/00B29C45/00B29C45/16B29L31/36B29L31/34
Inventor 谢芳昌林一鸣
Owner MERRY ELECTRONICS CO LTD
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