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Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof

An epoxy adhesive, ultra-thin technology, applied in the direction of adhesives, epoxy resin adhesives, polyurea/polyurethane adhesives, etc., can solve the problems of glass transition temperature lowering, affecting heat resistance, etc.

Active Publication Date: 2008-12-17
HUNAN SHENLI IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention also aims at the defect that the glass transition temperature of the polyurethane prepolymer modified epoxy resin is lowered, thereby affecting the heat-resistant performance, and uses a small amount of nano-powder material to make the glass transition temperature of the modified epoxy adhesive higher than that of the general epoxy adhesive. higher glass transition temperature

Method used

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  • Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof
  • Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Preparation of polyurethane prepolymer

[0038] See Table 1 for the feed amount and free isocyanate group content of the prepolymer during the preparation of the polyurethane prepolymer.

[0039] The preparation of table 1 polyurethane prepolymer

[0040]

[0041] Preparation:

[0042] Add 100g of polyether polyol into a reactor equipped with a stirrer, dropping funnel, vacuum tube, and water bath heating device, heat up to 90°C, vacuumize for 2 hours, the vacuum degree is 0.092-0.095MPa, cool down to 60°C, Eliminate the vacuum, add TDI dropwise through the dropping funnel, react at 60°C for 1 hour, raise the temperature to 70°C for 1 hour, then raise the temperature to 85°C for 1 hour, drop to room temperature, and take samples to measure the free isocyanate groups of the prepolymer.

[0043] (2) Preparation of component A in modified epoxy adhesive

[0044] Ingredients: epoxy resin E-44 15g 6458 14g

[0045] Reactive diluent W-95 10g

[0046] Polyurethane ...

Embodiment 2

[0064] The ingredients of component A are:

[0065] Epoxy resin E-44 10g E-51 8g 6458 14g

[0066] Reactive diluent 622 6g 678 2g

[0067] Polyurethane prepolymer 19g

[0068] Inorganic powder filler Wollastonite powder 20g Quartz powder 10g Barite powder 11g

[0069] All the other are the same as embodiment 1

[0070] The preparation method is the same as that in Example 1, and the product is used for the composite of thin stone and aluminum honeycomb. The test results are shown in Table 2.

Embodiment 3

[0072] B component ingredients are:

[0073] Modified amine curing agent 38g accelerator DMP-30 5g coupling agent KH-560 4g

[0074] Glass flakes 8g

[0075] Inorganic powder filler Wollastonite powder 25g Talc powder 15g Barite powder 5g

[0076] All the other are the same as embodiment 2

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Abstract

The invention relates to a modified epoxy adhesive, in particular to a modified epoxy adhesive used in composite preparation of ornamental stone materials by ultra-thin stone materials and aluminum honeycombs. A component A of the adhesive is made from 20 percent to 40 percent of epoxy resin, 5 percent to 15 percent of reactive diluent, 1 percent to 5 percent of nanometer powder material, 10 percent to 30 percent of polyurethane prepolymer and 40 percent to 60 percent of inorganic powdery filler, while a component B is made from 20 percent to 30 percent of modified amine curing agent, 1 percent to 5 percent of accelerant, 1 percent to 5 percent of organic silicon coupling agent, 5 percent to 10 percent of glass flake and 40 percent to 60 percent of inorganic powdery filler; the proportion by weight between the component A and the component B is 2.5 to 3.5: 1. The modified epoxy adhesive is applied to composition of the ultra-thin stone materials and aluminum honeycombs, the key technical indexes of which meet the national building material industry standards of ultra-thin natural stone composite boards.

Description

Technical field: [0001] The invention relates to an adhesive for compounding thin stone materials, in particular to a modified epoxy adhesive for compounding ultra-thin stone materials and aluminum honeycombs. Background technique: [0002] In the past ten years, the demand for stone materials for architectural decoration in the world has increased significantly. Among them, the development of ultra-thin stone and aluminum honeycomb composite building decoration materials is faster. The surface of decorative stone is beautiful and gorgeous, and it is the first choice material for interior and exterior wall and floor decoration of high-end hotels, shopping malls, exhibition centers and high-end residences. However, the stone structure is unstable, and the thickness of the decorative stone material is generally around 20mm. Due to the large proportion of stone, the weight of the building and the difficulty of construction are increased. The price of precious stone is expensiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/08B32B7/12
Inventor 袁素珍王理尧李冬月刘辉
Owner HUNAN SHENLI IND
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