Apparatus and method for press welding printed circuit to flat display panel
A printed circuit and equipment technology, applied in the direction of circuits, electrical solid devices, instruments, etc., can solve the problems of increased processing time, etc., and achieve the effects of easy bonding process, avoiding damage and cracks, and high-speed bonding process
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[0055] The present invention is used to illustrate the drawings attached to the preferred embodiments, so that the examiners can better understand the present invention, its advantages, and achieve the purpose of the present invention. In the following description of the present invention, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Wherein, the same element numbers represent the same elements.
[0056]According to an embodiment of the present invention, an apparatus and method for bonding a printed circuit can be used to bond (pre-bond) a printed circuit to a substrate of a flat panel display (FPD), such as a flexible Printed circuit (FPC), tape and reel chip carrier package (TCP), general batch flexible circuit board (CBF) and driver IC (driver IC), and flat panel display is such as plasma display panel (PDP), liquid crystal display (LCD) and Organic Light Emitting Diodes (OLED). For the convenienc...
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