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Metal piece electroplating method

A metal parts, anti-electroplating technology, applied in the field of machining, can solve problems such as poor bonding force and delamination, and achieve the effects of increasing bonding force, reducing costs, and avoiding waste

Inactive Publication Date: 2008-11-12
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a metal electroplating method, which can avoid unnecessary waste, reduce the cost of electroplating, and can improve the bonding strength of the electroplated metal parts and other parts or PCBs. Relatively poor (especially gold-plated parts), prone to delamination at high temperatures

Method used

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Examples

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Embodiment Construction

[0011] The invention relates to a surface of a metal part that needs to be electroplated for metal parts, especially for bonding between structural parts, between structural parts and current-carrying parts, and for bonding or mechanical fastening of signal parts in the communication field. Carry out the method for selective electroplating, describe in detail the specific flow process of carrying out one selective electroplating on the metal part surface in one embodiment of the present invention below:

[0012] In the film sticking step, the surface of the metal part to be electroplated is covered with an anti-electroplating film that overlaps with the part that does not need to be electroplated;

[0013] For metal parts that can be processed on the exposure machine, such as metal substrates, photosensitive film can be used as the anti-electroplating film. The advantage of using photosensitive film is that it can only make more complex anti-plating patterns, and use photosensi...

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Abstract

The invention discloses a metal part electroplating method, which comprises the following: a step of membrane sticking, which is to cover an anti-electroplating membrane coincided with the non-electroplating part of a metal part on the surface of the metal part to be electroplated; a step of electroplating, which is to carry out the electroplating of the metal part covered with the anti-electroplating membrane on the surface; a step of stripping, which is to remove the anti-electroplating membrane on the metal part after electroplating. The metal part electroplating method can avoid unnecessary waste and reduces electroplating cost; moreover, the method greatly increases bonding force when a metal part is glued to other parts or a PCB, and the metal part does not delaminate or fall off even when the metal part is exposed in a high-temperature environment for a long time.

Description

technical field [0001] The invention relates to machining technology, in particular to a method for electroplating machined metal parts. Background technique [0002] In the prior art, overall electroplating is used for metal parts that need to be electroplated, such as between structural parts and structural parts, between structural parts and current-carrying parts, bonding or mechanical fastening of signal parts in the communication field. (including gold plating, silver plating, copper plating, etc.), but in practical applications, only part of most metal parts need to be electroplated. This overall electroplating method also electroplates the parts that do not need to be electroplated, resulting in Unnecessary waste, and when the electroplating layer on the surface of metal parts is to be bonded to other parts or PCBs, the bonding force is relatively poor (especially gold-plated parts), and it is easy to cause delamination at high temperatures. Contents of the inventi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02
Inventor 张松峰冯冲曾平
Owner SHENNAN CIRCUITS
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