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Electrolyte and method for electrolytic deposition of gold-copper alloys

A gold-copper alloy, electrolytic deposition technology, applied in the field of electrolytic composition, can solve problems such as toxicity

Active Publication Date: 2008-10-22
ENTHONE INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Proposed solutions consisted of depositing ternary alloys containing Au / Cu / Ag to produce thick deposits, but the addition of Ag produced a strong nodulation effect, which was unacceptable for thick deposits
Additionally, certain processes known in the art contain cadmium, which is considered toxic and may be banned from use

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  • Electrolyte and method for electrolytic deposition of gold-copper alloys
  • Electrolyte and method for electrolytic deposition of gold-copper alloys

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Embodiment Construction

[0011] The present invention relates to an electrolytic composition for electrolytic deposition of a gold-copper alloy onto the surface of a substrate, wherein the electrolytic composition comprises a source of gold ions, a source of copper ions, potassium cyanide and at least one complexing agent, the The complexing agent is selected from the group consisting of ethylenediaminetetraacetic acid [EDTA], diethylenetriaminepentaacetic acid and nitrilotriacetic acid [NTA], hydroxyethyliminodiacetic acid [HEIDA], nitrilopropionic acid Diacetic acid [NPDA], iminodiacetic acid [IDA], nitrilotrimethylphosphoric acid [NTMA, Dequest 2000], triethanolamine [TEA], where the concentration of copper ions and potassium cyanide (KCN) make copper / free potassium cyanide mass ratio in the range of 3-7.

[0012] The present invention further relates to a method of electrolytically depositing gold-copper alloys using the composition described above, whereby the carat value and color of the depos...

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Abstract

This invention relates to an electrolyte as well as a method for the deposition of a gold-copper alloy on a substrate surface. With the electrolyte and method disclosed, deposition of gold-copper alloys with a value of carat in the range of 12 to 19 kt is possible. Beneath a source of gold and copper, the inventive electrolyte comprises potassium cyanate (KCN) in a concentration capable to maintain a copper to KCN ratio in the range of 3 to 7, and at least one complexing agent of the group consisting of ethylenediamine tetraacetic acid, diethylenetriamine pentaacetic acid, nitrilo-triacetic acid, ethylenediamine tetraacetic acid [EDTA], diethylenetriamine pentaacetic acid and nitrilo-triacetic acid [NTA] Hydroxyethyl imino diacetic acid [HEIDA], nitrilo propionic diacetic acid [NPDA], imino diacetic acid [IDA], nitrilo trimethylphosphoric acid [NTMA, Dequest 2000], triethanol amine [TEA].

Description

Technical field: [0001] The invention relates to an electrolytic composition and method for electrolytically depositing a gold-copper alloy on the surface of a substrate. Background technique: [0002] The use of gold alloys to apply coatings to the surface of objects for decorative or functional purposes is well known in the art. Especially for applications in the field of jewelry or electrotechnical devices, alloy layers whose physical properties - such as brightness, hardness, wear resistance or color - can be varied are required. These properties are influenced by the alloy composition (ie, the metal that is co-plated with gold) and the components of the electrolytic composition used for alloy deposition (ie, additives such as electrolytes, brighteners, complexing agents, etc.). Additionally, methods and plating parameters, such as temperature and current density, affect the quality and color of the deposit. [0003] Within this technical field, there have been numerou...

Claims

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Application Information

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IPC IPC(8): C25D3/56C25D3/62
CPCC25D3/62C25D3/58
Inventor 盖伊·德斯托马斯
Owner ENTHONE INC
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