A temperature difference semiconductor module with cooling and heating and temperature difference power generation function

Abstract

The invention provides a multi-function module which is used to implement fluid circulation heat conduction at the same time to two ends of temperature difference semiconductor, and not only used to cause cooling and heat, but also used to generate temperature difference power. The multi-function module is made of at least two thermal conductivity boxes with snake-shaped flume in-house, a temperature difference semiconductor component, a heat insulation layer, a retaining plate, a pipe and a joint, a coil radiator, a water pump, and so on. The device can be installed in existing refrigerator and air conditioner directly replacing compressor. And the device has the advantages of simple manufacturing structure, easy installation, all machinery fixation, small size, light weight, low cost, high universality, high use-value, and the device is in favor of industrialization.

Description

1. Technical field [0001] The invention is a thermoelectric semiconductor based on double-liquid circulation heat conduction, which integrates the functions of heating, cooling, and thermoelectric power generation, and relates to the fields of semiconductor refrigeration, heating, and thermoelectric power generation. 2. Background technology [0002] Thermoelectric semiconductor is a kind of technology that utilizes the Petier effect and Seebeck effect of semiconductor materials to absorb heat and release heat by passing direct current across the two ends of the P.N type semiconductor material or provide a temperature difference between the two ends of the P.N type semiconductor material to generate electricity. Semiconductor device. The semiconductor device is widely used in various fields because of its light weight, small size, no noise, no pollution, fast start-up, precise temperature control and use of various heat sources to generate electricity. [0003] At present, ...

AI Technical Summary

Problems solved by technology

Among them, the paste method and the welding method are one-time installation, which cannot be disassembled and repaired. In addition, the force of the entire heat transfer device is concentrated on the fragile cooling sheet, resulting in a very low strength of the entire device, and the temperature difference semiconductor element is easily affected by external forces. and damaged

Among them, the manufacturing process and cost of the welding method are very high, and the yield rate is low, so it is not suitable for mass production

Most of the existing mechanical fixing methods are directly fixed by metal screws. The thermoelectric semiconductor will cause a thermal short circuit due to the thermal conductivity of the screws, which will greatly reduce the system efficiency. Moreover, the fixing force of the installation is not easy to adjust. tight and crushed

Generally speaking, the reliability of various existing fixing methods is not ideal.

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