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Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems

A heat exchanger, miniature technology, used in heat exchange equipment, lighting and heating equipment, metal processing equipment, etc., to solve problems such as undescribed manufacturing

Active Publication Date: 2008-08-20
COOLIGY INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Said patent, incorporated herein by reference, describes polygonal ring structure openings, but does not describe methods of making such layers

Method used

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  • Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
  • Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
  • Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems

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Embodiment Construction

[0057] The present invention describes a method of forming a conductive layer and joining multiple layers together to form a three-dimensional microstructured region. According to the present invention, microstructured regions comprise microgrids, microchannels, or some other microstructures. FIG. 1A shows a first embodiment of a micro-grid region, and FIG. 2A shows a second embodiment of a micro-grid region. Figure 1C shows multiple layers formed and joined together to form microchannels in accordance with an embodiment of the present invention.

[0058] Figure 1A shows two window layers 100, 150 formed from two thermally conductive layers in accordance with the present invention. Preferably, the two thermally conductive layers are formed using a wet etch process in which a photographic tool is used to determine the location and pattern of the microscopic openings 120, 170 of the window layers 100, 150. The two window layers include a plurality of thick solid rods 110, 160 ...

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Abstract

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

Description

technical field [0001] The invention relates to the field of heat exchangers. More particularly, the present invention relates to a method of fabricating a high surface to volume ratio material structure from multiple layers and to incorporating said structure into a microstructured heat exchanger device for liquid cooling systems for efficient heat absorption. Background technique [0002] Efficient heat transfer in liquid cooling systems requires that the flowing liquid be in contact with the thermally connected surface area as much as possible to absorb heat from the cooling device. Reliable and efficient fabrication of high surface volume ratio material (HSVRM) structures is therefore of great importance for the development of efficient micro heat exchangers. The use of silicon microchannels is a heat collector structure in liquid cooling systems proposed earlier by the assignee of the present invention. See, for example, co-pending US Patent Application Serial No. 10 / ...

Claims

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Application Information

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IPC IPC(8): F28F3/14B21D53/00B21D39/06B23P15/26
CPCF28F7/02F28F2260/02F28F3/086
Inventor M·达塔M·麦马斯特R·布鲁尔P·周P·曹G·乌帕达亚M·蒙奇
Owner COOLIGY INC
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