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Method for detecting heat transfer resistance/heat transfer factor of building enclosure structure by infrared thermal imaging system

A technology for building envelope structure and infrared thermal imaging camera, which is applied in the direction of thermal conductivity of materials, instruments, and thermal development of materials, etc., can solve the problems of difficult data reliability, difficult operation, and difficulty, so as to overcome the large error of test data. , The effect of fast detection and accurate test data

Inactive Publication Date: 2011-04-20
NORTHWEST UNIVERSITY FOR NATIONALITIES
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Frequent extrusion is likely to damage the working condition of the heat flow meter, but it is not easy to know whether the working condition of the heat flow meter is normal, because the calibration of the heat flow meter is not easy to operate, so the reliability of the data is very high. Difficult to guarantee
[0006] 3. When the heat flow meter method is used for detection, it is necessary to measure the temperature of the outer surface of the masonry, which is relatively difficult in actual operation, especially for high-rise buildings. It is very dangerous and difficult to arrange temperature sensors on the surface of the outer wall of the building
However, at present, infrared thermal imaging technology is only used to detect thermal bridges and defects in buildings.

Method used

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  • Method for detecting heat transfer resistance/heat transfer factor of building enclosure structure by infrared thermal imaging system
  • Method for detecting heat transfer resistance/heat transfer factor of building enclosure structure by infrared thermal imaging system
  • Method for detecting heat transfer resistance/heat transfer factor of building enclosure structure by infrared thermal imaging system

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Embodiment Construction

[0052] The requirements of the heat flow meter method are the same, and the detection condition requires one-dimensional steady-state heat transfer.

[0053] First of all, sampling points are selected for the enclosure structure. The area of ​​the detection area should be able to represent the thermal characteristics of the enclosure structure to be detected. The aspect ratio of the area should be consistent with the aspect ratio of the display window of the infrared thermal imager, so that the detection area Display window filled with thermal imaging cameras.

[0054] Before selecting a point, observe the detection area with an infrared thermal imager (FLUCK Ti45 type in the United States), so that the geometric center of the selected area does not have an extreme temperature area (highest temperature or lowest temperature), and mark the selected area, you can use a A heating wire is formed around the selected area, which will be clearly visible in the window of the thermal i...

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Abstract

The present invention relates to a method which uses an infrared thermal imager for in-situ quantitative-detecting a heat transfer resistance / heat transfer coefficient of a building enclosure structure. An energized electric heating wire is used for identifying a selected area on the surface of the enclosure structure; an electric thermoscope is used for measuring the temperature of the identified area; the infrared thermal imager is used for taking a picture of the identified area and an infrared thermogram of the area is obtained, the electronic thermoscope is used for measuring and recording the indoor and outdoor temperature; an image analysis software of the infrared thermal imager is used for analyzing and processing the infrared thermogram to obtain a value, an average heat transfer resistance of the building enclosure structure is obtained by substituting the value into the formula to calculate an average heat transfer coefficient of the enclosure structure. The invention has the advantages of flexible infrared thermal image shooting, low requirement to the experiment condition, quick testing and accurate data, and overcomes the defect of big error when the data is tested by a heat flow meter method and the requirement to a meter box and an insulating box by a hot box method.

Description

technical field [0001] The invention relates to a detection method of a building enclosure structure, in particular to an on-site detection method for quantitatively detecting the heat transfer resistance / heat transfer coefficient of a building enclosure structure by using an infrared thermal imager. Background technique [0002] With the in-depth development of building energy conservation work, the on-site inspection of building energy conservation will face unprecedented challenges. Judging from the current domestic situation, the heat flow meter method and the hot box method are mostly used to detect the heat transfer resistance / heat transfer coefficient of building envelope structures on site. [0003] The heat flow meter method is based on the premise of one-dimensional steady-state heat transfer, by detecting the heat flux density of the heat flow meter and the temperature difference between the two sides of the masonry, according to the formula: R=Δt / q to calculate t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20G01N25/18G06F19/00
Inventor 杨永恒曹万智王洪镇甘季中
Owner NORTHWEST UNIVERSITY FOR NATIONALITIES
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