Highly-effective high accuracy sapphire polishing liquid and preparation method thereof
A high-precision, polishing liquid technology, used in grinding/polishing equipment, polishing compositions, chemical instruments and methods, etc., can solve the problems of unsuitable cleaning process, high solid content, low efficiency, etc., and achieve high polishing efficiency and solid state. Low content and the effect of reducing the burden
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Embodiment 1
[0014] Weigh 100 grams of silica sol with a particle size of about 15 nanometers and a solid content of 30%, add it to 882 grams of water, and stir evenly at room temperature. Then add 10.0 grams of EDTA dipotassium salt, and stir further. Continue to add 8.0 grams of silane polyglycol ether. Finally the pH was adjusted to 10 with potassium carbonate. The final conductivity was 3.2ms.
[0015] The prepared samples were polished on a Logitech CDP single-side polisher. Down pressure: 2psi, rotation speed of the lower plate and carrier plate is 50RPM, flow rate of polishing liquid: 100ml / min. The polishing rate of the polishing liquid was 61.2 nm / min. There is no deposition on the surface of the polishing machine and the polished product.
Embodiment 2
[0017] Weigh 50 grams of silica sol with a particle diameter of about 15 nanometers and a solid content of 30%, add it to 1822 grams of water, and stir evenly at room temperature. Then add 13.5 grams of tetramethylammonium chloride, and stir further. Continue to add 4.5 grams of polyethylene glycol ether. Finally the pH was adjusted to 10 with potassium carbonate. The final conductivity is 100 μs.
[0018] The prepared samples were polished on a Logitech CDP single-side polisher. Down pressure: 2psi, rotation speed of the lower plate and carrier plate is 50RPM, flow rate of polishing liquid: 100ml / min. The polishing rate of the polishing liquid was 83.7 nm / min. There is no deposition on the surface of the polishing machine and the polished product.
Embodiment 3
[0020] Weigh 150 grams of silica sol with a particle size of about 50 nanometers and a solid content of 30%, add it to 1722 grams of water, and stir evenly at room temperature. Then add 13.5 grams of tetramethylammonium chloride, 10 grams of EDTA dipotassium salt, and stir further. Continue to add 10 grams of polyethylene glycol ether. Finally the pH was adjusted to 10 with copper sulfate. The final conductivity was 48ms.
[0021] The prepared samples were polished on a Logitech CDP single-side polisher. Down pressure: 2psi, rotation speed of the lower plate and carrier plate is 50RPM, flow rate of polishing liquid: 100ml / min. The polishing rate of the polishing liquid was 90.5 nm / min. There is no deposition on the surface of the polishing machine and the polished product.
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