Display device and flat display device

A display device, planar technology, applied in lighting devices, printed circuits, instruments, etc., can solve problems such as uneven connection of terminals, achieve uniform thermal curing conditions, reduce bending stress concentration, and increase reliability.

Active Publication Date: 2008-05-28
JAPAN DISPLAY INC +1
View PDF1 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In such a case, the conditions at the time of thermal head crimping are different, so the connection of the terminal part is uneven.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display device and flat display device
  • Display device and flat display device
  • Display device and flat display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] FIG. 1 is a liquid crystal display module for TV as an example of implementing the present invention. In FIG. 1 , a TFT substrate 1 on which pixel electrodes, thin film transistors, and the like are arranged in a matrix and a color filter substrate 2 on which color filters are formed in a matrix are stacked. The TFT substrate 1 is made larger than the color filter substrate 2 in order to provide the COF 3 and the like on the TFT substrate. COF is an abbreviation for chip-on-film package, but this specification sometimes uses the meaning of COF film. Liquid crystal is interposed between the TFT substrate 1 and the color filter substrate 2 . An upper polarizing plate 8 is attached to the color filter substrate 2 , and a lower polarizing plate (not shown) is attached to the lower surface of the TFT substrate 1 . On both sides of the TFT substrate 1, a COF on which an IC chip 4 including a driving circuit is mounted is provided. In Fig. 1, three COFs are installed on the...

Embodiment 2

[0096] In the first embodiment, a plurality of branch positions of the thick wiring is provided, and the branch positions are regularly changed for each line. Example 2 is a case where the branch positions are continuously changed for each adjacent thin wiring. In FIG. 13 , each thick wiring branch on the COF is two thin wirings. The positions of the branches are gradually separated from the TFT substrate side terminal 34 of the COF such that the wiring P1 is at the position A, the wiring P2 is at the position B, and the wiring P3 is at the position C. In this way, by dispersing the positions of the branches, it is possible to disperse the bending stress when bending the COF 3 .

[0097] FIG. 13 is an example of continuously changing the positions where thick lines of the same width branch into thin lines, but the continuous change of branch positions is not limited to lines of the same width. FIG. 14 is an example of changing the branch position when wirings having differen...

Embodiment 3

[0102] On the COF, straight wiring is rarely possible from the TFT substrate-side terminal 34 of the COF to the printed wiring board-side terminal 35 of the COF, and the wiring is usually bent on the way. In addition, when the wiring is bent, the width of the line may also change at the same time. There are various methods of bending the wiring in this case. The simplest method is the one shown in Figure 16. FIG. 16 shows a case where the width of the wiring is changed to w2 after the wiring having the width w1 is bent. In FIG. 16, the thin wiring before bending is constant at w1. In addition, the thick wiring after bending is also constant at w2. However, in this case, since the thickness of the wiring changes rapidly at the bent portion, when the COF 3 is bent, disconnection is likely to occur at the bent portion of the wiring, for example, the portion B in FIG. 16 . This embodiment is an example of preventing disconnection at such bent wiring portions.

[0103] FIG. 17...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention prevents, when a COF which is connected with an external circuit is bent in a flat display device, the disconnection of lines on the COF. At a position where a line of the COF is connected to terminal portions of a TFT, and the line having a large width is branched into lines having a small width T 1 to T 3 or T 4 to T 6. By displacing line branching positions from each other as indicated by an arrow A and an arrow B, when the COF is bent or deformed, stress applied to the line branching positions can be dispersed thus preventing the disconnection of lines.

Description

technical field [0001] The present invention relates to a display device, and more particularly, to a connection structure of a terminal portion for electrically connecting a flat-panel display device to an external circuit, and a structure of a flexible wiring film. Background technique [0002] From computer monitors, mobile phones, etc. to TVs, liquid crystal display devices are being used in a wide range of applications. In order to drive the liquid crystal display panel, it is necessary to supply power, signals, etc. from the outside, but this is often done through a chip-on-film package (COF) connected to the terminal portion of the liquid crystal display panel. One side of the COF is provided with a terminal for connecting to a terminal of a liquid crystal display panel, and the other side is provided with a terminal for connecting to a printed wiring board, etc., and an IC chip with a built-in liquid crystal drive circuit and the like is mounted on the COF. In addit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13H01L27/32H05B33/00H01L21/60H01L23/50
CPCH05K1/028H05K3/361H05K2201/09254H05K2201/09663H05K2201/09781G02F1/13452H01L2924/0002H01L2924/00G02F1/1345
Inventor 竹中雄一
Owner JAPAN DISPLAY INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products