Polyimide film

A technology of polyimide film and film, applied in printed circuit, printed circuit components, printed circuit, etc., can solve problems such as anisotropic fluctuation, achieve the effect of suppressing dimensional change and improving appearance yield

Active Publication Date: 2008-03-19
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In such a situation, an attempt was made to improve productivity by specifying the maximum amount of slack, but since the improvement was achieved by stretching, there was a fatal problem of large fluctuations in the anisotropy in the width direction (Patent Document 3 )

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example

[0051] One embodiment of the present invention will be described below.

[0052] The polyimide film used in the present invention can be produced by a conventionally known method using a solution containing polyamic acid.

[0053] As a method for producing polyamic acid, any known method can be used, and it is usually produced as follows: substantially equimolar amounts of aromatic acid dianhydride and aromatic diamine are dissolved in an organic solvent, and The obtained polyamic acid organic solvent solution was stirred until the polymerization of the above-mentioned acid dianhydride and diamine was completed. These polyamic acid solutions are usually obtained at a concentration of 5 to 35% by weight, preferably 10 to 30% by weight. Appropriate molecular weight and solution viscosity are obtained at concentrations in this range.

[0054]As the polymerization method, any known method and a method combining them can be used. The polymerization method in the polymerization o...

Embodiment

[0160] Evaluation of the film in the present invention was performed as follows.

[0161] (Tear strength retention before and after PCT)

[0162] Measurements were performed before and after PCT treatment according to ASTM D-1938.

[0163] In addition, PCT treatment was performed on the conditions of 150 degreeC and 100%RH for 12 hours.

[0164] (slack)

[0165] Hang the film on two support rolls installed at intervals of 3 m, fix one end, hang a load of 3 kg / m on the other end, and read the difference in slack between the width direction (TD) of the film and the horizontal base line generated at this time. In addition, in the measurement of the amount of slack, the line in contact with the highest position of the film in the TD direction as shown in FIG. 3 was defined as a horizontal base line. The amount of slack was measured at intervals of 50 mm from the end of the film, and the maximum value was read.

[0166] (Measurement of dynamic viscoelasticity)

[0167] Using D...

reference example 1

[0174] (Reference Example 1: Synthesis of Nylon Modified Epoxy Adhesive)

[0175] 50 parts by weight of polyamide resin (Platabond M1276 manufactured by Japan's Lilusan Corporation), 30 parts by weight of bisphenol A type epoxy resin (EPICO-TO 828 manufactured by Oil Chemical Shell Epoxy Corporation), cresol novolak type epoxy resin In the solution of 10 parts by weight, 150 parts by weight of toluene / isopropanol 1 / 1 mixed solution, mix 45 parts by weight of diaminodiphenyl sulfone / dicyandiamide 4 / 120% methyl cellosolve solution, and prepare the adhesive agent solution.

[0176] The adhesive was coated on a PET film with a thickness of 25 μm so as to be 11 μm after drying, and dried at 120° C. for 2 minutes to obtain a B-stage adhesive with a support.

[0177] (Determination of thermoplasticity).

[0178]A polyimide film composed of thermoplastic polyimide block components was produced at a maximum calcination temperature of 300°C and a calcination time of 15 minutes. It was...

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Abstract

The present invention provides a polyimide film with a small rate of dimensional change in the manufacturing process when used in FPC. In particular, the object is to produce a metal-clad laminate with few abnormal parts such as wrinkles, and obtain dimensional change at a high yield. FPC with a small rate can solve this problem with the following polyimide film, which is a polyimide film having a tan δ peak temperature equal to or greater than 320° C. and less than 380° C. in the measurement of dynamic viscoelasticity, and is characterized in that : The maximum slack of the film is 13mm or less.

Description

technical field [0001] The present invention relates to a non-thermoplastic polyimide film that can be used suitably for a flexible printed board or a cover film for a flexible printed board. Background technique [0002] In recent years, with the reduction in weight, miniaturization, and high density of electronic products, the demand for various printed circuit boards has been increasing. Among them, the demand for flexible printed wiring boards (also called FPC, etc.) has grown particularly rapidly. FPC has a structure in which a circuit made of metal foil is formed on an insulating film. [0003] The above-mentioned FPC is mostly used, and generally a flexible insulating film formed of various insulating materials is used as a substrate, and a metal foil is bonded to the surface of the substrate by heating and pressing through various adhesive materials. A flexible metal-clad laminate manufactured by the method. As the insulating film, a polyimide film or the like is p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08L79/08H05K1/03
CPCC08G73/105H05K1/0393C08J5/18C08J2379/08C08L79/08C08G73/1071H05K1/0346C08G73/1042C08G73/1067C08G73/1046H05K2201/0154C08G73/10
Inventor 金城永泰菊池刚松胁崇晃
Owner KANEKA CORP
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