Semiconductor packaging structure with common type wafer holder

Abstract

The present invention relates to a semiconductor packaging structure with a common wafer bearing seat. A lead frame has the common wafer bearing seat and a plurality of pins. The common wafer bearing seat has a plurality of mould flow through holes communicating with each other upwards and downwards, which can be arranged in an array or arranged around the circumference. The wafers with different size can be installed on the common wafer bearing seat, and is wrapped with a mould sealing glue body. The number for the mould flow through holes uncovered by the wafer or the communication area also can be increased following the contract changing for the size of the wafer, which makes the upper mould flow or lower mould flow with higher flow speed having separated flowing effect, so the installing on the same guide line frame for the wafer with different size can reach the balance for the upper and lower mould flows.

Description

technical field [0001] The invention relates to a semiconductor package technology for balancing mold flow for chips with different sizes in the same lead frame structure, in particular to a semiconductor package structure with a common chip seat. Background technique [0002] In the conventional TSOP and TQFP semiconductor packaging fields, a die pad of a lead frame is used to fix a semiconductor chip and electrically connect the chip to the pins of the lead frame. Finally, mold compound is used to cover and protect the chip. During the mold forming process of the molding colloid, there will be problems of insufficient filling or exposed gold lines due to the difference in the flow rate of the upper and lower mold flows. Therefore, according to the different size changes of the wafer, different lead frames are designed according to the mold flow simulation model to achieve a balance between the upper and lower mold flows. However, the increase in the material types of the ...

AI Technical Summary

Problems solved by technology

When another wafer 110A with a smaller size is fixed on the wafer holder 130 of the above-mentioned same lead frame, the space above the wafer 110A becomes smaller and the obstacle factor becomes smaller, so the flow velocity of the upper mold flow 121 will be greater than the flow velocity of the lower mold flow 122 , leading to an unbalanced mold flow. Therefore, in the known conventional technology, a single type of lead frame can only carry a single-sized chip, otherwise there will be problems of insufficient filling and exposed gold wires

[0005] China Taiwan Patent Announcement No. 396557 "The method of balancing the mold flow (mold flow) of packaging IC devices" is to use a part of the pin to bend to correct the balance of the upper and lower mold flow, but the lead frame with the bent pins can only Holds single size wafers

[0006] China Taiwan Invention Patent No. I236123 "semiconductor package", it is to make the periphery of the chip seat form a plurality of stepped parts that are sunken downwards, and these stepped parts are supported on the lower mold when pressing the mold, so as to avoid The tipping of the wafer seat occurs during the glue injection, which solves the problem of exposed gold lines. Although the size of the wafer can be slightly changed, the problem of unbalanced upper and lower mold flow still exists, so there will be situations where the filling is not full.

In addition, the supporting point of the stepped part will be exposed on the bottom surface of the molding compound, which will change the appearance of the product

In addition, only the center of the large-sized chip adheres to the chip holder, and the periphery of the chip is not fixed, so there will be problems of non-sticking when bonding wires.

[0007] It can be seen that the above-mentioned existing semiconductor packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general products do not have a suitable structure to solve the above-mentioned problems. This is obviously related The problem that the industry is eager to solve

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