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Gel injection molding material composition for aluminium silicon carbide integrated circuit pipe shell and method for preparing products

A technology of material composition and integrated circuit, which is applied in the direction of chemical instruments and methods, circuits, electrical components, etc., can solve the problems of high cost, difficult-to-form special-shaped parts, and difficult-to-form shells, etc. Complete, low-cost results

Inactive Publication Date: 2008-02-06
西安明科微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation methods of aluminum carbide silicon carbide shells publicly reported in China include: injection molding and dry pressing molding. , low cost, easy mass production, etc., but it is difficult to form a shell with a complex shape, so it is not suitable for forming a shell

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A gel casting material composition for an aluminum silicon carbide integrated circuit package comprising:

[0024] Silicon carbide powder SiC 40~80 parts

[0025] Deionized water H 2 O 20~45 parts

[0026] Acrylamide AM 2~6 parts

[0027] Methylenebisacrylamide MBAM 0.1-0.5 part

[0028] Ammonium persulfate APS 0.01~0.06 parts

[0029] Tetramethylethylenediamine ETMDA 0.03 to 0.10 parts

[0030] Dispersant 1 to 3 parts

[0031] The dispersant is polymethacrylic acid amine or polyacrylic acid amine, any one or two of them can be added simultaneously.

[0032] The method for preparing the product from the gel injection molding material composition of the aluminum silicon carbide integrated circuit shell is carried out according to the following steps:

[0033] a. Weigh the silicon carbide micropowder, acrylamide, methylenebisacrylamide and dispersant in the silicon carbide gel injection molding slurry formula according to the proportion, pour it into the ball mill,...

Embodiment 2

[0043] Including 45-70 parts by weight of silicon carbide micropowder, 25-40 parts of deionized water, 3-5 parts of acrylamide, 0.2-0.4 parts of methylenebisacrylamide, 0.02-0.05 parts of ammonium persulfate , 0.05 part to 0.080 part of tetramethylethylenediamine, 1.5 part to 2.7 parts of dispersant, the method for preparing the product is the same as in Example 1.

Embodiment 3

[0045] Including 50-60 parts by weight of silicon carbide micropowder, 28-35 parts of deionized water, 3.5-4.5 parts of acrylamide, 0.3-0.4 parts of methylenebisacrylamide, 0.03-0.04 parts of ammonium persulfate , 0.06 part to 0.070 part of tetramethylethylenediamine, 2 parts to 2.5 parts of dispersant, the method for preparing the product is the same as in Example 1.

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PUM

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Abstract

The invention discloses a gel-casting material composition of aluminum silicon carbide integrate circuit tube casing and preparation method thereof. The composition comprises silicon carbide micro powder, deionized water, acrylamide, methylene-bis-acrylamide, ammonium persulfate, tetramethyl ethylenediamine and dispersant. The preparation method includes the following steps: weighing substances in the formulation proportionally and pouring into a ball mill; ball milling and filtering; stirring in a regulating tank for 2 hours; adjusting the pH value of the slurry to about 10 with ammonia and vacuum pumping for 2 hours above the vacuum degree of -700mmHg; adding ammonium persulfate and tetramethyl ethylenediamine solutions dropwise in stirring, and then continuing to stir for 1 minute and turning off the stirrer; injecting the slurry into a mould to fill the mould sufficiently; demoulding, drying and polishing to get a tube casing preform with complete shape. The invention has the advantages of low cost, large batch, complete shape, small dimension shrinkage rate, thus the invention is a near net shape molding method for preparation of deformed parts with complicated shapes.

Description

technical field [0001] The invention relates to an electronic packaging material and a forming method thereof. The invention is particularly suitable for the gel injection molding material composition of aluminum silicon carbide integrated circuit shell and the method for preparing the product. Background technique [0002] In the known technology, the electronic packaging materials widely used in integrated circuit package shells are A-92 alumina black porcelain (first generation packaging material), aluminum nitride (second generation packaging material) and aluminum silicon carbide Materials (third-generation packaging materials), because aluminum-silicon carbide materials have small specific gravity, high specific stiffness, good thermal conductivity, and a thermal expansion coefficient close to that of silicon, they have become the third-generation electronic packaging materials and have been mass-produced abroad. It is still in the research and development stage in Ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/00C04B26/00C04B14/36C04B22/14C04B24/12H01L23/06
Inventor 李宏杰于家康马俊立
Owner 西安明科微电子材料有限公司
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