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Integrated transportation control for wafer fabrication facility

A technology of factory automation and transportation system, applied in the direction of comprehensive factory control, general control system, control/regulation system, etc., can solve the problem of not considering the real-time traffic status of the wafer manufacturing plant, and achieve the effect of eliminating traffic jams and improving transmission efficiency.

Active Publication Date: 2008-01-23
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Typically, this decision is made solely on production data and does not take into account real-time traffic conditions in the fab

Method used

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  • Integrated transportation control for wafer fabrication facility
  • Integrated transportation control for wafer fabrication facility
  • Integrated transportation control for wafer fabrication facility

Examples

Experimental program
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Embodiment Construction

[0054] FIG. 1A shows a schematic diagram of a 300 micron wafer fabrication plant according to an embodiment of the present invention. Wafer fabrication facility 100 may be considered a "very high level" when it includes multiple stages, respectively denoted by reference numerals 102 and 104 as shown in FIG. Giga fab". A "cross-floor transfer job" involves transferring a cassette, or FOUP, from one of the floors 106, 108 to the other. Similarly, a "cross-stage transfer job" involves transferring a cassette, or FOUP, from one of the stages 102 and 104 to the other stage.

[0055] Each stage 102 , 104 includes a plurality of bays 110 , each bay 110 including process tools or equipment 112 . The equipment 112 in each bay 110 is interconnected to each other by an overhead transport (OHT) system 114 within a bay. The bays 110 are interconnected with each other by an interbay OHT system 116 which will hereinafter be considered a so-called super highway. As known to those skilled ...

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PUM

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Abstract

The invention discloses a factory automation system and related methods. An embodiment is a factory automation system suitable for use in a wafer fabrication facility comprising a plurality of bays, wherein each bay includes a plurality of fabrication equipment interconnected by an intra-bay overhead wafer transport (OHT) system, and The OHT system between the first bay and the OHT system between the second bay are used to interconnect the overhead wafer transport system in the bay. The factory automation system includes: a manufacturing execution system for providing information about wafer lots being processed in the wafer fab; a material control system for providing flow information about wafer shipments in the wafer fab; and an integrated transportation control system for selecting a destination for a wafer cassette containing a plurality of wafers and a route to the selected destination based on a transfer request using lot information generated by the manufacturing execution system and flow information generated by the material control system .

Description

technical field [0001] The present invention relates to a system and method for integrated transportation control, in particular to a system and method for implementing integrated transportation control in a wafer manufacturing plant. Background technique [0002] The manufacture of semiconductor devices involves a series of manufacturing steps. These manufacturing steps are completed in a specific order and usually within a specific period of time using various high-tech products and measuring equipment. The main function of the wafer material flow system in a wafer manufacturing plant (or "fab") is to transfer wafers to each piece of equipment at the correct point in time, and to track the position and status of wafers throughout the process. [0003] Automated material handling systems (AMHS) are used in wafer fabs to perform automated functions more efficiently, consistently, and safely than can be accomplished by manual means. Although the progress of semiconductor dim...

Claims

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Application Information

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IPC IPC(8): G05B19/04H01L21/677B65G49/07B65G43/00
CPCG05B2219/31372G05B19/4189G05B2219/45031G05B2219/31272G05B2219/31271Y02P90/02
Inventor 游志源游仁祈汪明
Owner TAIWAN SEMICON MFG CO LTD
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