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Hot-melt adhesive of thermal shrinkage polyester amide in use for material of thermal shrinkage, and preparation method

A polyester amide, hot melt adhesive technology, applied in the direction of adhesives, etc., can solve the problems of high price, complex process, increased product cost, etc., and achieve the effect of low cost, simple process, and reduced opportunities for hydrogen bonds

Inactive Publication Date: 2007-12-26
JIANGSU POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In the synthesis, grafting and cross-linking schemes are adopted, and expensive grafting agents are added in the reaction process, which increases the product cost and the process is relatively complicated

Method used

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  • Hot-melt adhesive of thermal shrinkage polyester amide in use for material of thermal shrinkage, and preparation method
  • Hot-melt adhesive of thermal shrinkage polyester amide in use for material of thermal shrinkage, and preparation method
  • Hot-melt adhesive of thermal shrinkage polyester amide in use for material of thermal shrinkage, and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Mix 584g of low-molecular-weight polyamide (trade name: 011 resin, Zhejiang Pujiang Resin Factory, softening point: 90-120°C) with 58g of waste polyester, add it to a reaction kettle with a vacuum and condensation system, heat up until the material melts, and stir Continue to raise the temperature to 250° C., blend for 1.5 hours, then add 50 g of ethylene glycol, alcoholyze for 0.5 hours, and finally compress and polymerize under reduced pressure for 1.5 hours, with a vacuum degree of 0.065 MPa. The obtained product is an amber viscous liquid, which becomes a tough solid after cooling, with a softening point of 166° C. and a viscosity (190° C.) of 6000 mPa·S. Its structural formula is as follows:

[0030]

[0031] where: R 1 is the residue of dimer acid; R 2 for -(CH 2 ) 3 -; R 3 Ethylene terephthalate oligomers of waste polyester residues.

Embodiment 2

[0033]Mix 584g of low-molecular-weight polyamide (trade name: 010 resin, Yonglin Oil Chemical Factory, softening point: 90-120°C) with 30g of waste polyester, add it to a reactor with a vacuum and condensation system, heat up until the material melts, Continue to raise the temperature to 250°C under stirring, blend for 1.5 hours, then add 72 g of 1,3-butanediol, alcoholyze for 0.5 hours, and finally compress and polymerize under reduced pressure for 1.5 hours, with a vacuum of 0.065 MPa. The resulting product was an amber viscous liquid which cooled to a tough solid. Its structural formula is as follows:

[0034]

[0035] where: R 1 is the residue of dimer acid; R 2 for -(CH 2 ) 2 -, R 3 Ethylene terephthalate and 1,3-butylene terephthalate oligomers which are waste polyester residues.

Embodiment 3

[0037] Mix 584g of low-molecular-weight polyamide (trade name: 010 resin, Zhejiang Pujiang Resin Factory, softening point: 90-120°C) with 58g of waste polyester, add it to a reaction kettle with a vacuum and condensation system, heat up until the material melts, and stir Continue to raise the temperature to 250° C., blend for 1.5 hours, then add 15 g of ethylene glycol and 35 g of 1,6-hexanediol, alcoholyze for 0.5 hours, and finally compress and polymerize under reduced pressure for 1.5 hours with a vacuum of 0.065 MPa. The resulting product was an amber viscous liquid which cooled to a tough solid. Its structural formula is as follows:

[0038]

[0039] where: R 1 is the residue of dimer acid; R 2 for -(CH 2 ) 2 -, R 3 Ethylene terephthalate and 1,6-hexanediol terephthalate oligomers which are waste polyester residues.

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Abstract

This invention relates to a polyesteramide hot-melt adhesive for pyrocondensation material, and its preparation method from polyamide and water PET. The polyesteramide hot-melt adhesive has a repeating structure shown in this invention, wherein, R1 is residue derived from dimmer acid; R2 is -(CH2)2-12- and its possible branched isomer; R3 is terephthalate polyester segment (derived from polyester residue), terephthalate oligomer, terephthalate dimmer or benzene ring. The preparation method comprises ester-amide exchange, alcoholysis and polycondensation. By utilizing waste polyester as part of the the raw material, the product cost is reduced without sacrificing product quality, and meanwhile white pollution is reduced. The preparation method does not need solvent recovery or product purification, and has such advantages as no pollution, and simple and stable process.

Description

technical field [0001] The invention relates to a polyester amide hot-melt adhesive for heat-shrinkable materials and a method for preparing the hot-melt adhesive by copolymerizing low-molecular polyamide and PET polyester. Background technique [0002] Heat shrinkable material is a new type of memory material developed in the past 30 years. It is a revolution in the history of new material development. The corresponding heat shrinkable products are used in power industry, electronics industry, telecommunications industry, automobile industry, military industry and office and family It has a huge application market, and with the development of science and economy, its market potential is unlimited. Both the heat-shrinkable product itself and the application process require a corresponding matching special adhesive sealant, which plays the role of bonding, sealing, and insulation during the heat-shrinking process of the heat-shrinkable material. Due to the inherent excellent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/12
Inventor 杜郢蔡华兵陈志刚高国生
Owner JIANGSU POLYTECHNIC UNIVERSITY
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