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Anti-infrared light filter for packing image sensor

An image sensing and infrared technology, applied in the direction of optical filters, image communication, color TV components, etc., can solve the problems of thick overall package structure, unbearable coating, high hardness, etc., to improve coating peeling and avoid dispersion Phenomena, Effects of Refractive Index Stabilization

Inactive Publication Date: 2007-09-05
李建德
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the pyrex hard glass has a certain thickness to achieve the required refractive index, not only the overall package structure is thick, but also the hard glass itself has a high hardness, which is easy to cause cracks
Furthermore, the coating cannot withstand the high temperature during packaging, which also causes problems such as peeling

Method used

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  • Anti-infrared light filter for packing image sensor
  • Anti-infrared light filter for packing image sensor
  • Anti-infrared light filter for packing image sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The production process of this example is to mix all the ingredients in the following table 1 completely, put it in a crucible with a capacity of about 100ml, melt the mixture at a temperature of 1480°C for 3 hours, and then cool it down to 1150°C in 2 hours. Then the molten crystal liquid is taken out and injected into the preheated mold body with a temperature of 550°C. Next, place it in an annealing furnace at 480°C for 16-18 hours, and then cool down naturally for 4-5 hours to room temperature. Furthermore, the above-mentioned raw rough crystal embryos are flattened for subsequent processing operations, and then the crystal embryos are subjected to procedures such as processing and grinding, precision polishing, and light-transmitting molding and cleaning to form lenses. Subsequently, a protective film of titanium oxide, silicon oxide, and niobium oxide is deposited by general evaporation or sputtering (in this case, evaporation) as an anti-environment protection la...

Embodiment 2

[0028] Please refer to FIG. 2. FIG. 2 is a schematic diagram of an image sensing module 100 in a preferred embodiment of the present invention, wherein an image sensing module 100 with a base 50 also includes an optical lens 40 and an anti-infrared filter chip 10. A packaging material 20, and an image sensing component 30, and the optical lens 40 contains several optical lenses 41, 42, 43. In addition, the anti-infrared filter chip 10 used in this example is the 0.30 mm thick anti-infrared filter chip 10 prepared in Embodiment 1, and the image sensing device is a charge-coupled device (CCD).

[0029] As shown in FIG. 2 , in the image sensing module 100 of the present invention, the anti-infrared filter chip 10 is interposed between the optical lens 40 and the image sensing component 30 . In addition, one side of the anti-infrared filter chip 10 is coated with a layer of packaging material 20 (in this example, epoxy resin is used), and after a packaging process, the anti-infrar...

Embodiment 3

[0032] Please refer to FIG. 3 . FIG. 3 is a spectral comparison result of the anti-infrared filter chip according to the first embodiment of the present invention and the reflective infrared filter lens in a conventional coating process. Fig. 3a is a transmission spectrum diagram of incident light at different angles (0°, 30°, 45°) for the anti-infrared filter chip of the present invention. Fig. 3b is a transmission spectrum diagram of the incident light at different angles (0°, 30°) for the reflective infrared filter lens in the traditional coating process. As shown in FIG. 3 a , the spectrum difference between the forward and oblique shades of the anti-infrared filter chip of the present invention is very small, wherein the transmission spectra of the 0° forward light and the 30° oblique shades almost overlap. As shown in Figure 3b, the reflective infrared filter lens in the traditional coating process has a significant difference in the wavelength width of the transmission ...

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Abstract

A filtering chip of infrared ray proof type is featured as enabling to effectively filter out infrared ray and enabling to be directly used as packaging glass of image sensing component.

Description

technical field [0001] The invention relates to an anti-infrared filter chip, in particular to an optical lens suitable for filtering out infrared rays and an image sensing module capable of filtering out infrared rays. Background technique [0002] For example, most of the current digital image sensing components are converted by electrical signals, so infrared rays are likely to cause color deviation of images. Therefore, in order to meet the visual satisfaction of human eyes, IR cut filters have been applied in digital image sensors such as digital cameras, computer video systems, digital cameras, video mobile phones, and image capturing telescopes. In this way, the sensing component can be effectively blocked from sensing infrared rays, so as to correct the light sensitivity of the color of the image sensing component so as to achieve consistency with human visual color. [0003] However, the reflective infrared filter made by the current coating method still faces some...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/20H01L21/00H04N5/335H04N25/00
Inventor 李建德林宛静
Owner 李建德
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