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Ink composition for etching resist, method of forming etching resist pattern using the same, and method of formng microchannel using the ink composition

A technology of ink composition and anti-corrosion coating, applied in nanotechnology for information processing, removal of conductive materials by chemical/electrolytic methods, ink, etc., can solve problems such as expensive photoinitiators of photocurable inks

Active Publication Date: 2007-08-22
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this patent, the ink composition is not described in detail, but generally, photocurable inks must be accompanied by relatively expensive photoinitiators
Also, when using an electron beam, it is necessary to use the electron beam device in a vacuum

Method used

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  • Ink composition for etching resist, method of forming etching resist pattern using the same, and method of formng microchannel using the ink composition

Examples

Experimental program
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Effect test

preparation Embodiment 1

[0071] Mix 10 parts by weight of urethane acryl (urethane acryl) emulsion (dry weight), 5 parts by weight of polytetrafluoroethylene dispersion solution, 10 parts by weight of glycerin, 20 parts by weight of ethylene glycol, 0.1 parts by weight of a fluorine-based surfactant and 54.9 parts by weight of deionized water were then filtered using a 1 micron filter to prepare an ink for an anti-corrosion coating. The ink exhibited a contact angle of 35° on copper surfaces and 55° on stainless steel surfaces. Consequently, the ink exhibits a larger contact angle and thus less spreading than conventional organic solvents.

preparation Embodiment 2

[0073] Mix 10 parts by weight ethoxylated glycerin acrylate, 20 parts by weight ethylene glycol, 0.1 parts by weight fluorine-based surfactant, and 69.9 parts by weight deionized water in a mixer, then use a 1 micron filter Filtration to prepare inks for anti-corrosion coatings. The ink exhibited a viscosity of 15 cP and a contact angle of 45° on a stainless steel surface. Therefore, the ink exhibits higher viscosity and larger contact angle than conventional organic solvents.

Embodiment 1

[0075] The copper substrate was cleaned with 5% aqueous hydrochloric acid and deionized water, and then dried. The ink prepared in Preparation Example 1 was sprayed onto the cleaned copper substrate using an inkjet head produced by MICROFAB, USA, to form a microchannel pattern. Then, the resulting pattern was dried on a hot plate at 80°C for 3 minutes, completely cured on an oven at 220°C for 30 minutes or more, and then etched using an etching solution containing 17 parts by weight of ferric chloride and 20 parts by weight of hydrochloric acid 30 minutes. Then, the remaining anti-corrosion coating pattern is removed by rubbing the etched pattern with acetone, so that the portion of the copper substrate not covered by the anti-corrosion coating pattern is etched to a depth of 50 micrometers or more and 50 micrometers or smaller width. As a result, a microchannel pattern is formed.

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Abstract

Provided are an ink composition for an etching resist, a method of forming an etching resist pattern using the ink composition, and a method of forming a microchannel using the ink composition. The ink composition is suitable for forming a micro pattern due to its poor spreading on the substrate and is suitable for etching-resist for copper of a printed circuit board and deep etching a stainless steel substrate due to its excellent chemical properties that allow it to resist an etching solution.

Description

technical field [0001] The invention relates to an ink composition for anti-corrosion coating, a method for forming an anti-corrosion coating pattern by using the ink composition, and a method for forming a microchannel by using the ink composition. Background technique [0002] An anti-corrosion coating is an anti-corrosion film for forming a pattern by etching, which is mainly used in the manufacturing process of semiconductor circuits and printed circuit boards. In such fabrication processes, photoreactive photoresists are often used as etch resist coatings. A method of forming an etch resist pattern using a photoresist will now be described. First, a liquid photoresist is applied on a surface to be patterned by spin coating or the like to form a film. Alternatively, a dry photoresist film may be provided on the surface by attaching or using similar methods. Then, ultraviolet rays, electron beams, or the like are selectively irradiated onto a portion of the photoresist...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027B41M5/00C09D11/00C09D11/023C09D11/033C09D11/10C09D11/102C09D11/106C09D11/326C09D11/38C23F1/00C23F1/18C23F1/28H05K3/06
CPCH05K2203/013H05K2203/0786B82Y10/00C23F1/02B82Y40/00H05K3/061G03F7/0002C09D11/30G03F7/027
Inventor 金俊衡金贤湜权宁云徐姃贤
Owner LG CHEM LTD
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