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Flexible copper-polyimide laminate and manufacturing method thereof

The technology of polyimide layer and polyamic acid is applied in the field of flexible copper-polyimide laminate and its manufacturing, and can solve the problems of high unit cost, expensive polyimide film, complicated manufacturing process and the like, Achieving the effect of low moisture content and good dimensional stability

Inactive Publication Date: 2007-08-01
KOLON IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Conventional polyimide films are expensive, resulting in high unit costs due to their complex manufacturing process and also have problems with high moisture content

Method used

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  • Flexible copper-polyimide laminate and manufacturing method thereof
  • Flexible copper-polyimide laminate and manufacturing method thereof
  • Flexible copper-polyimide laminate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 18

[0051] Each of the polyamic acids prepared in Synthesis Examples 1 to 18 was coated on copper (commercially available from Furukawa Corporation) in a thickness of 12 μm with an applicator, and dried at 80° C. for 2 hours, and dried at 200° C. Imidization was carried out for 2 hours and 350° C. drying for 1 hour to prepare a flexible copper-clad laminate having a polyimide layer with a thickness of 25 μm.

Embodiment 19 to 21

[0055] Based on the polyamic acid solid content of 100 parts by weight, add 5.0 parts by weight of SiO 2 Particles (Gasil35M, supplied by Crossfield Company) were added to each polyamic acid prepared in Synthesis Examples 2, 7 and 15, and were dispersed at 9500rpm with a homogenizer (T25 basic type, supplied by IKA Laboratechnik Company) for 5 minute.

[0056] The solution thus prepared was coated on copper (commercially available from Frukawa Corporation) with a thickness of 12 μm, and imidized by drying at 80° C. for 2 hours, 200° C. for 2 hours, and 350° C. for 1 hour to prepare Flexible copper-polyimide laminate with a polyimide layer of 25 micron thickness.

Embodiment 22 to 24

[0058] Based on the polyamic acid solid content of 100 parts by weight, add 5.0 parts by weight of TiO 2 Granules (R700, supplied by DuPont (DuPont) Company) were added in each polyamic acid prepared in Synthesis Example 2, 7 and 15, and with a homogenizer (T25 basic type, supplied by IKA Laboratechnik Company) at 9500rpm Disperse for 5 minutes.

[0059] The solution thus prepared was coated on copper (commercially available from Furukawa Corporation) with a thickness of 12 μm, and imidized by drying at 80° C. for 2 hours, 200° C. for 2 hours, and 350° C. for 1 hour to prepare Flexible copper clad laminate with polyimide layer of 25 micron thickness.

[0060] For each of the flexible copper-clad laminates manufactured in Examples and Comparative Examples, curl, moisture content, dimensional stability, tensile properties, folding resistance, and flex fatigue resistance were analyzed according to the method in Table 3 properties and weight average molecular weight analysis. T...

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Abstract

The present invention provides a flexible copper-polyimide laminate including a linear random block polyimide layer formed on the at least one side thereof, the linear random block polyimide layer comprising 0.25 to 90.25 mol.% of a repeating unit l represented by the formula 1, 0.25 to 90.25 mol.% of a repeating unit m represented by the formula 2, 0.25 to 90.25 mol.% of a repeating unit n represented by the formula 3, and 0.25 to 90.25 mol.% of a repeating unit o represented by the formula 4. The flexible copper-polyimide laminate having a polyimide layer is free from curls and excellent in dimensional stability, tensile property, folding endurance and resistance to flexural fatigue with low moisture content.

Description

technical field [0001] The invention relates to a flexible copper-polyimide laminated board and a manufacturing method thereof. More specifically, the present invention relates to a flexible copper-polyimide laminate having a polyimide layer and a method for manufacturing the same. The layer was prepared by polymerizing polyamic acid from two diamines and two dianhydrides, coating the polyamic acid on a copper film and imidizing it. Background technique [0002] Recently, the rapid growth of industry and technology has significantly accelerated the development of the electronics industry related to mobile phones, PDPs, etc. in an obvious way, and miniaturization and flexible technology have become indispensable and necessary for the electronics material industry . [0003] Many methods have been proposed to overcome the problem of using adhesives in this industrial field, only solving the problem of decrease in non-combustibility, but causing curling and wrinkling due to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08C08G73/10
CPCB32B27/34H05K1/0393B32B2264/102B32B2307/306B32B2307/206C08L79/08B32B2307/734H05K1/0346C08G73/14B32B2250/02H05K2201/0209B32B15/20C08G73/105B32B2264/104B32B2457/08B32B15/08C08G73/1071C08G73/1067B32B2307/546H05K2201/0154
Inventor 金尚均文正烈金泰亨金圣根丁畅范朴钟旼
Owner KOLON IND INC
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