Substrate recognition method and element mounting system

Abstract

The present invention provides a system for smoothly producing a circuit board while streamlining substrate recognizing processing of each apparatus included in a component mounting line. Each apparatus in the component mounting line is provided with a dispenser, an application inspecting device , first and second mounting devices , a mounting inspecting device, and a curing device. In each apparatus, a tact time of each of the devices is compared to specify a device controlling the speed of a line tact. If the specified device is a device using a local mark to be attached on a substrate, that means, the device for recognizing an image of the mark to create correction data, an operation of recognizing one part or entire of the mark to be image-recognized in this device is allocated to one or a plurality of devices in a process in an upstream of this device and executed, and the allocation is performed in a range where the tact time of each device does not delay compared to the tact time of the curing device.

Description

technical field [0001] The present invention relates to a component mounting system in which a plurality of devices such as a solder printing device, a dispenser, a mounting device, a reflow oven, and various inspection devices are arranged in series, and particularly relates to a method capable of rationally performing substrate identification on the component mounting system and device. Background technique [0002] As a conventional mounting device, a plurality of mounting machines (referred to as a unit mounting machine) are arranged in a row, and components are mounted on a circuit board in a distributed manner. [0003] Among such mounting devices, each device performs mounting processing in a state where the circuit board is positioned at a predetermined position by the positioning device. However, at this time, due to the position deviation of the circuit board relative to the main body of the device and the relative position deviation of the printed wiring pattern ...

AI Technical Summary

Problems solved by technology

[0006] However, in order to efficiently perform component mounting processing in a mounting device composed of many unit mounters, it is necessary to reduce the processing load of the unit mounters to shorten the production tempo, but on the other hand, it is more important to equally distribute each unit Processing burden on the installer

That is, if the unevenness of the processing load makes the processing time of a certain device (process) too long, the production rhythm of the entire mounting device depends on the processing time of the mounting machine (the mounting machine must be the one that controls the production rhythm speed of the mounting device). device), thereby preventing a smooth installation process

In this regard, according to the method (apparatus) of Patent Document 1, the time required for the board recognition operation of the entire mounting device can be shortened, but the processing load of the front unit mounting machine tends to increase. Therefore, in order to perform the mounting process smoothly, there are need to improve this

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