Semi-conductor light source device

Abstract

A semiconductor light source device is provided. A semiconductor wafer is attached to and electrically connected to the side of a thermal conducting baseplate and then put into a concentration light cup. Light produced by the semiconductor wafer is concentrated into the direction of the light exit of the concentration light cup. Furthermore, a principal light source can be arranged in the concentration light cup at the same time. The principal light source is a plurality of semiconductor wafers which are evenly attached around an internal conductor and an external conductor that are arranged with the same axis and are isolated by an insulation layer. The semiconductor wafers are combined by means of serial connection, parallel connection or serial and parallel connection, and then are connected with the internal conductor and the external conductor which are used as power supply electrodes. Then the semiconductor light source device both with light concentration and heat dissemination effects is formed.

Description

【Technical Field】 [0001] The present invention relates to a semiconductor light source device, in particular to a semiconductor light source device that uses the sides and planes of a thermally conductive substrate to attach a semiconductor chip to make it a semiconductor light source device that combines light concentration and heat dissipation. 【Background technique】 [0002] Conventionally, various bulbs such as incandescent lamps, halogen lamps or fluorescent lamps are mostly used as the light source of the light source device. Recently, semiconductor chips such as light emitting diodes (LEDs) have the advantages of small size, power saving and long life, etc., they are gradually replaced and become extremely popular light emitting sources. [0003] For the structure of the light source device, a multi-chip, high-power LED package has become an inevitable trend requirement. For example, US Patent No. 6,492,725 named "Concentrically Leaded Power Semiconductor Device Package" pr...

AI Technical Summary

Problems solved by technology

Although this kind of packaging structure can solve the heat dissipation problem of packaging multiple high-power chips, because only one side of the packaging structure can be attached to the semiconductor chip, the number of packages of the semiconductor chip is limited, and when the semiconductor chip is In the case of light-emitting diodes, because the semiconductor wafers distributed around the package structure cannot be concentrated, it is difficult to meet the light-gathering requirements when used in semiconductor light source devices.

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