Integrated circuit with memory cells comprising a programmable resistor and method for addressing memory cells comprising a programmable resistor
A technology for memory cells and integrated circuits, which is applied in the field of integrated circuits containing memory cells including programmable resistors and for addressing memory cells including programmable resistors, can solve problems such as inability to provide sufficient power and the like
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[0032] figure 1 A circuit diagram of a basic phase change memory cell according to a first embodiment of the present invention is shown. If the selected value of the programmable resistor R is such that V d -V s about V dd / 3, then the best power dissipation of the programmable resistor can be obtained in the memory cell.
[0033] therefore,
[0034] P opt m *V dd
[0035] P opt =3 / 4*I m *2 / 3*V dd =1 / 2*I m *V dd
[0036] R opt =(2 / 3V dd ) / (3 / 4*I m )=8 / 9*(V dd / I m )
[0037] P opt ≤ I m *V dd
[0038] One side of the programmable phase change resistor R is connected to the drain terminal of the NMOS transistor T, 2*V dd The voltage is applied to the other side of the programmable phase change resistor R. When the source terminal is connected to the common ground V s =0, the voltage V dd Applied to the drain terminal of the NMOS transistor T.
[0039] The value of resistor R must be designed so that the following equation holds:
[0040] V D =2*V ...
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