Material supplying device and method

A technology of a supply device and a stirring device, which is applied in the direction of assembling printed circuits, electrical components, circuits, etc. with electrical components, and can solve problems such as shedding of paste solder, reduction of mechanical strength of metal masks, and supply of difficult solder particles to workpieces, etc. Achieve the effects of suppressing welding bridges, high precision and no fluctuation quantitative spit out, and realizing quantitative spit out

Inactive Publication Date: 2009-07-29
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the screen printing method, the following problems arise: since the opening of the metal mask needs to be miniaturized, the mechanical strength of the metal mask is reduced, or the paste solder becomes difficult to fall off from the opening of the metal mask.
[0010] However, the solder material described in Patent Document 2 has a problem that it is difficult to supply the solder particles to the workpiece in a uniformly dispersed state in the liquid because the solder particles settle in the liquid.

Method used

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  • Material supplying device and method
  • Material supplying device and method
  • Material supplying device and method

Examples

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Embodiment Construction

[0042] Embodiments of the present invention will be described below with reference to the drawings.

[0043] Figure 1 to Figure 4 It is a perspective view showing an embodiment of a solder material supply device and method in the present invention, and the process follows figure 1 → figure 2 → image 3 → Figure 4 → figure 1 ... in order. Hereinafter, it demonstrates based on these drawings. However, since the liquid and solder particles that form the solder material are not shown in the figure, please refer to Figure 6 Wait.

[0044] Embodiments of the present invention use solder particles as solid particles, liquid with a flux function as liquid, solder material as material, magnetic stirrer (Magneticus ster-ra) as stirring device, uniaxial eccentric screw pump (hereinafter A dispenser) will be described as an example as a supply device or a pump, and a sub-tank as a storage device.

[0045] First, the structural features, functions, and effects of the solder ma...

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Abstract

PROBLEM TO BE SOLVED: To feed a material made of a mixture of solid particles and a liquid to a work as the solid particles are kept dispersed uniformly in the liquid.SOLUTION: A solder material feeder 10 feeds a solder material S made of a mixture of solder particles and a liquid having a flux effect with the solder particles precipitating in the liquid, to a work W using a means including a magnetic stirrer 50 and a dispenser 60. The magnetic stirrer 50 stirs the solder material S in a container 51. The dispenser 60 sucks from the container 51 the solder material S with the solder particles afloat in the liquid as stirred by the magnetic stirrer 50 using a nozzle 61 serving both for suction and delivery, and delivers the solder material S to the work W.

Description

technical field [0001] The present invention relates to a material supply device and method for supplying a material formed of a mixture of a liquid having a fluxing agent function and solder particles, in which the solder particles settle, to a workpiece. More specifically, it relates to a material supply device suitable for forming protruding solder bumps on, for example, semiconductor substrates, interposer substrates, and printed wiring boards to manufacture FC (flip chip) or BGA (ballgrid array). Background technique [0002] In the past, the general method of forming solder bumps is to apply paste solder on the pad electrodes of the substrate by using screen printing method or dispensing method (dispensing), and then reflow the paste solder after heating. weld. [0003] On the other hand, Patent Document 1 describes a paste solder made of a mixture of a special solder powder and a fusing agent. The solder powder forms an oxide film on the surface of the solder partic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/60H05K3/24H05K3/34B23K1/20
CPCH01L24/11H01L2224/11H01L2924/00012
Inventor 白井大小野崎纯一斋藤浩司安藤晴彦
Owner TAMURA KK
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