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Tensile bond strength testing method

A technology of tensile bond strength and test method, which is applied in the direction of instruments, measuring devices, and mechanical devices, etc., can solve the problems of sample oblique failure, inaccurate size, and small ultimate tensile force of the test block, reaching a record The data and analysis results are accurate, the test accuracy is high, and the effect of loading (uniform force)

Inactive Publication Date: 2009-05-06
QINGDAO TECHNOLOGICAL UNIVERSITY
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AI Technical Summary

Problems solved by technology

To sum up, these two methods have the following defects: First, because the size of the steel plate is not accurate during processing or the surface is not smooth when the steel plate is bonded in the first method, the tension action points on the upper and lower surfaces of the test block are not on a straight line, which causes the sample to be damaged by oblique tension. ; secondly, the test block in method 2 is under non-uniform tension, and the larger the bonded area, the more obvious the effect of non-uniformity; , will generate torque to the test block, causing the test block to be destroyed in advance
The above defects will lead to a small ultimate tensile strength of the test block and premature failure
Therefore, many peer experts have carried out improved exploration and research on the current test methods, but no outstanding progress has been seen

Method used

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Embodiment Construction

[0009] The method and process for testing the tensile bond strength between the adhesive 4 and the polystyrene board 3 will be specifically described below through examples.

[0010] 1. Test conditions:

[0011] (1) The polystyrene board and polystyrene board adhesive determined by the external insulation system of the exterior wall generally use 18kg / m 3 ~22kg / m 3 Polystyrene board 3, and polymer cement mortar is used as adhesive 4.

[0012] (2) Two-component epoxy resin, the mixing ratio of the two components is epoxy resin (E-44): curing agent (T-31) = 4:1.

[0013] (3) Test fixture: the ring on the steel roof 5 must be firmly welded to the center of the steel roof, and the steel rod 7 under the steel frame 1 is welded to the center of the frame.

[0014] 2. Test block production:

[0015] (1) Cut the polystyrene board material to be tested into plates with a size of 40mm×40mm×30mm with a heating wire or a paper cutter. Apply thick (3±1)mm adhesive 4 on one side of pol...

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Abstract

The related tension and bond strength testing method for adhesive and polyphenyl plate comprises: cutting target plate into cubic block as sample, coating adhesive on one surface and then another surface, curing for 10-20day; dipping into water for 40-60day, taking out to dry for 2h; then, sticking sample surface with adhesive to smooth steel plate, forcing tensile force to test its strength. This invention has reliable principle, high accuracy and precise result.

Description

Technical field: [0001] The invention relates to a method for testing the tensile bond strength of an adhesive and a polystyrene board in an external thermal insulation system of an exterior wall, in particular to a method for testing the tensile bond strength of an adhesive and a polystyrene board by using a frame uniform stretching method method of measurement. Background technique: [0002] In recent years, the technology of external thermal insulation of external walls has developed rapidly, especially the external thermal insulation system of external walls has been widely promoted. In the external thermal insulation system of the external wall, the tensile bond strength between the adhesive and the polystyrene board is an important index to measure the quality of a certain thermal insulation system. There are two main test methods for determining the strength: the first is the direct tension method, such as the industry standard of the People's Republic of China "Tech...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
Inventor 王命平
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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