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Fan combination and fan speed-governing method

A speed regulation method and fan speed technology, applied in cooling/ventilation/heating transformation, pump control, non-variable pumps, etc., can solve the problem of noise and dust ingress reduction, board temperature changes, equipment temperature rise, etc. problem, achieve the effect of solving noise and dust-proof problems, improving service life and solving heat dissipation problems

Inactive Publication Date: 2008-04-16
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, changes in device configuration may also cause changes in board temperature
For example, when a board with high power consumption is added due to equipment expansion, the heat emitted by the board will cause the operating temperature of the board in the adjacent slot to rise
[0008] Moreover, the speed regulation method based on the ambient temperature in the prior art cannot perceive the change of the temperature of the single board inside the device because the temperature sensor is placed at the air inlet of the device.
At this time, if the external ambient temperature remains unchanged, the speed of the fan will remain unchanged, so that the temperature of the board that rises cannot be cooled, which may affect the reliable operation of the board; and when the temperature of the board drops, the fan cannot be adjusted accordingly. speed for low noise and dust ingress
In addition, when the configuration of the board inside the device changes, the air duct resistance changes accordingly, which in turn leads to a change in the wind speed received by the board, thus affecting the adjustment effect of the fan
[0009] 2. When the equipment runs for a period of time, the dust-proof net will be blocked to a certain extent. If the fan speed remains unchanged, the air volume entering the equipment will be reduced due to the blockage of the dust-proof net, which will cause the internal temperature of the equipment to rise, and then Affects the reliable operation of the board
[0010] To sum up, the fan speed regulation method based on the ambient temperature in the prior art cannot dynamically adjust the fan speed with the change of the board temperature, and thus cannot adjust the relationship between heat dissipation, noise and dust resistance of the device to the best state

Method used

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  • Fan combination and fan speed-governing method
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Examples

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no. 1 example

[0094] The first embodiment: Here, only the determination process of the four parameters is introduced, and the other processes are the same as those described above, so they will not be repeated here.

[0095] (1) Since the present invention adjusts the speed based on the actual chip temperature inside the device, once the device configuration changes or the state of business operation causes the temperature to rise, the present invention can automatically increase the speed of the fan to ensure that the heat dissipation of the system can meet the requirements of the chip. Requirements, so the speed regulation curve can be determined according to the standard configuration of the equipment and the average business traffic in the standard configuration of the single board. In addition, all the single boards can run the business normally, and the business can not be at the line speed. When determining the two variable speed control points, put the equipment into a temperature co...

no. 2 example

[0098] The second embodiment: Here, only the determination process of the four parameters is introduced, and the other processes are the same as those described above, so they will not be repeated here.

[0099] In order to prevent the heat dissipation inside the device from meeting the heat dissipation requirements in the limit state, that is, when the chip business is running at line speed and the board is fully configured, the determination of the four parameters can also be performed according to the existing fan adjustment based on the ambient temperature. speed method, in determining the T of the speed regulation curve low and T high , ensure that the system is fully configured and that all board services run at line speed. The specific steps are as follows: (1) The fan speed is controlled at N min (Generally take 50% of the rated fan speed), the equipment is fully configured, and all services are running at line speed. Put the device in the temperature control box for...

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Abstract

The invention discloses a speed regulation method for a fan. Wherein, acquiring the lowest and highest rotation speed of fan as well as opposite chip temperature to determine the variation relation between speed and temperature; when need, obtaining current chip temperature to determine fan rotation speed according to said relation. It also discloses a fan combination, which comprises a single board with chip, a heat sink on chip, a fan fixed on said sink, and a temperature sensor on said board. This invention not only solves heat dissipation problem of board well, but also overcomes the noise and dust difficulty.

Description

technical field [0001] The invention relates to heat dissipation technology in the field of electronics or communication technology, in particular to a fan combination and a fan speed regulating method. Background technique [0002] Today's communication or electronic equipment is becoming more and more complex and highly integrated, which makes the power consumption of the equipment more and more large. In a fixed space, the substantial increase in power consumption has brought great challenges to the heat dissipation of the system. Usually, when natural heat dissipation cannot meet the requirements, fans need to be added to force air cooling to dissipate heat. However, adding a fan will cause new problems, that is: the noise of the equipment will increase with the increase of the fan speed, and at the same time, the amount of dust entering and leaving the equipment will also increase. It can be seen that the relationship between equipment noise, dustproof and heat dissipa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20F04D27/00
Inventor 方庆银张冬艳龙柏林
Owner HUAWEI TECH CO LTD
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